On the stacking-fault energies of copper alloys

Carter, C. B.; Ray, I.L.F.

doi:10.1080/14786437708235982

Cited by 189 publications

(44 citation statements)

References 29 publications

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“…Table 4 lists the formation energies of these stacking faults from our TB calculations. Our calculated energies are in excellent agreement with those from the experiments [40] and from the DFT and the EAM [41] calculations.…”

Section: Stacking Faults Surfaces and Clusterssupporting

confidence: 88%

Development of a tight-binding model for Cu and its application to a Cu-heat-sink under irradiation

Ding

Pan

2015

J Mater Sci

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An environment-dependent tight-binding potential model for copper within the framework of quantum theory is developed. Our benchmark calculations indicate that this model has good performance in describing the elastic property, the stability and the vibrational property of bulk copper, as well as in handling the clusters, the surfaces and the defective Cu systems. By combining this model with molecular dynamics, we study how the evolution of structural defects arising from the irradiation of the energetic particles influences the mechanical and the thermal properties of the copper-heat-sinks in fusion reactors. Based on our simulations, the heat blockade in the irradiated Cuheat-sinks is predicted. This finding is valuable for the development of wall materials in fusion reactors.

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Section: Stacking Faults Surfaces and Clusterssupporting

confidence: 88%

Development of a tight-binding model for Cu and its application to a Cu-heat-sink under irradiation

Ding

Pan

2015

J Mater Sci

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“…Deformation twinning occurs readily in Ag, which has a relatively low stacking fault energy in the range of 19 ± 3 mJ/m 2 (Suzuki and Barrett, 1958;Tadmor and Bernstein, 2004). In contrast, twinning is not so easy in Cu, which has a markedly higher value of the stacking fault energy (with reports ranging from 36 mJ/m 2 to 80 mJ/m 2 (Carter and Ray, 1977;Coulomb, 1981;Hirth and Lothe, 1982)). …”

Section: Introductionmentioning

confidence: 88%

Texture evolution via combined slip and deformation twinning in rolled silver–copper cast eutectic nanocomposite

Beyerlein

Mara

Bhattacharyya

et al. 2011

International Journal of Plasticity

133

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“…The SFE of silver is even slightly lower than SFE of copper (SFE in Ag is 22 mJ/m 2 [74], while SFE in Cu ranges according to different sources from 30 to 45 mJ/m 2 [88], and the respective normalized SFEs are 2.4-3.7 9 10 -3 for copper and 2.4 9 10 -3 for silver). ECS of R3 GBs in silver close to T m is very similar to that in copper [89].…”

Section: Faceting-roughening Of Twin Grain Boundaries In Other Materialsmentioning

confidence: 99%

Review: grain boundary faceting–roughening phenomena

et al. 2015

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Similar to free surfaces, the grain boundaries (GBs) in metals, semiconductors and insulators can contain flat (faceted) and curved (rough) portions. In the majority of cases, facets are parallel to the most densely packed planes of coincidence sites lattice formed by two lattices of abutting grains. Facets disappear with the increasing temperature (faceting-roughening transition) and the increasing angular distance from coincidence misorientation. The temperature of GB faceting-roughening transition T R decreases with the increasing inverse density of coincidence sites R. In case of fixed R, T R decreases with the decreasing density of coincidence sites in the GB plane.The intersection line (ridge) between facets or between facets and curved (rough) portions of surfaces can be of first order (two different tangents in the contact point) or of second order (common tangent, continuous transitions). The rough (curved) portions of GB can also form the firstorder rough-to-rough ridges (with two tangents). GB facets control the transition from normal to abnormal grain growth and strongly influence the GB migration, diffusion, wetting, fracture and electrical conductivity.

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On the stacking-fault energies of copper alloys

Cited by 189 publications

References 29 publications

Development of a tight-binding model for Cu and its application to a Cu-heat-sink under irradiation

Development of a tight-binding model for Cu and its application to a Cu-heat-sink under irradiation

Texture evolution via combined slip and deformation twinning in rolled silver–copper cast eutectic nanocomposite

Review: grain boundary faceting–roughening phenomena

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