On the simulation of panel distortions due to hot curing adhesives

Priesnitz, Konstantin; Sinke, J.; Benedictus, Rinze

doi:10.1016/j.ijsolstr.2014.03.016

Cited by 13 publications

(10 citation statements)

References 31 publications

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“…The constitutive equations for the adhesive in that model coincides with the ones used in a previous work of the authors (Priesnitz et al, 2014b) with minor modifications. For completeness reasons, those are summarized here.…”

Section: Simulationmentioning

confidence: 65%

“…To that end, the material constants of a commercial epoxy-based hot-curing adhesive system, Betamate 1496V (BM1496V), are determined. The simulation model is based on an earlier work by Priesnitz et al (2014b) and allows for chemically and thermally induced property changes of the adhesive. Priesnitz et al (2014a) provide experimental data on distortion development in different cure cycles, which is used as a comparison for the simulation results.…”

Section: Calculated Residual Stresses In a Bi-mentioning

confidence: 99%

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Simulation of the development of local panel distortions due to hot-curing adhesives

Priesnitz

Jansen

Sinke

et al. 2015

Journal of Materials Processing Technology

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Section: Simulationmentioning

confidence: 65%

Section: Calculated Residual Stresses In a Bi-mentioning

confidence: 99%

Simulation of the development of local panel distortions due to hot-curing adhesives

Priesnitz

Jansen

Sinke

et al. 2015

Journal of Materials Processing Technology

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“…These are changes in temperature, leading to thermal stresses; changes in moisture (or other absorbed solvent) content, leading to hygroscopic stresses, and changes due to chemical reactions in polymer matrix, leading to curing stresses. 23 For simplicity, we did not consider the hygroscopic stresses and curing stresses, and only included thermal residual stress in our models. 24 A thermal load, defined as a uniform temperature drop from the cure temperature of 127 C to ambient temperature of 25 C, was imposed before the tensile load.…”

Section: Residual Stressesmentioning

confidence: 99%

Influence of fiber length on the tensile behavior of fiber metal laminates with discontinuous reinforcement

Xue

Wang

et al. 2015

Journal of Reinforced Plastics and Composites

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In this paper, the influence of fiber length on the tensile behavior of fiber metal laminate, which is fabricated with unidirectionally arrayed chopped strand plies and aluminum sheets and named as unidirectionally arrayed chopped strand/aluminum laminate, was investigated based on finite element analysis and experiment. The unidirectionally arrayed chopped strand ply is made by introducing slits into carbon fiber reinforced plastic prepreg where continuous Ebers are arrayed unidirectionally. The fiber length is one of the most fundamental factors in tailoring the unidirectionally arrayed chopped strand/aluminum laminate to achieve the desired mechanic behaviors for specific applications. With longer fiber length, the mechanical behaviors of the bulk laminate should be more favorable, while the formability would be better with short fiber. Two-dimensional finite element models, with intra-laminar cohesive zone elements inserted into the slits of unidirectionally arrayed chopped strand plies and inter-laminar cohesive zone elements inserted into the all interfaces of unidirectionally arrayed chopped strand/aluminum laminate, respectively, were developed for the analysis of unidirectionally arrayed chopped strand/aluminum laminates with different fiber lengths under tension. Typical numerical results were validated by experimental results, which confirm that the tensile behaviors of the unidirectionally arrayed chopped strand/aluminum laminates with various different fiber lengths can be well predicted by present numerical modeling method.

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“…It can be seen that neglecting the mechanical properties of the adhesive in the heating and holding stage was easy to lead to large prediction deviation. Therefore, in order to achieve accurate prediction, some scholars proposed a multi-phase model covering the whole temperature cycle [14][15][16][17]. These models have been applied in coating process [15], resin mold material [16] and electronic packaging [17].…”

Section: Introductionmentioning

confidence: 99%

Numerical and Experimental Study on Curing-induced Residual Stress and Deformation of Adhesively Bonded Sandwich Structures of Dissimilar Materials

Zhu

et al. 2021

Preprint

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Adhesively bonded sandwich structure with dissimilar materials becomes an important means of lightweight for the next generation of autobody closure panels. However, during the baking process, the complicated change of physical properties of the adhesive can lead to structural mismatch deformation. In this paper, a multi-physics coupling numerical model of one-component hemming adhesive during the curing process is proposed, to reveal the deformation mechanism of adhesively bonded sandwich structures quantitatively. The material constitutive model of the hemming adhesive is established, considering evolution of curing properties. The curing process of typical aluminum alloy and steel bonded sandwich structure is simulated in COMSOL Multiphysics. The predicted surface deformation of the component is verified by experiment using Digital Image Correlation (DIC) technique, which captures the full-field displacement in a non-intrusive manner. Then, the development process of surface deformation of the outer panel and residual internal stress of the adhesive layer is analyzed, and the influence of temperature cycle on the maximum deformation of the component is discussed. The results show at the beginning of holding stage, the deformed component slightly rebounds, which is related to the chemical shrinkage. Mechanical strain caused by the coefficient of thermal expansion (CTE) and stiffness difference of the inner and outer panels is dominant in the adhesive layer. Reducing the curing rate and maximum holding temperature can reduce the overall deformation of the structure.

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On the simulation of panel distortions due to hot curing adhesives

Cited by 13 publications

References 31 publications

Simulation of the development of local panel distortions due to hot-curing adhesives

Simulation of the development of local panel distortions due to hot-curing adhesives

Influence of fiber length on the tensile behavior of fiber metal laminates with discontinuous reinforcement

Numerical and Experimental Study on Curing-induced Residual Stress and Deformation of Adhesively Bonded Sandwich Structures of Dissimilar Materials

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