2016 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD) 2016
DOI: 10.1109/ispsd.2016.7520815
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On the scaling limit of the Si-IGBTs with very narrow mesa structure

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Cited by 40 publications
(16 citation statements)
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“…It can be observed from Fig. 2 that the conventional IGBT-A shows non-saturated tendency of the Jc-Vce characteristics due to CIBL effect [7]. The CIBL mechanism can be explained as follows: during forward conduction, the whole mesa region becomes conductivity modulated, which is caused by the hole current flowing into the inversion layers and n + -cathode, as shown in Fig.…”
Section: Device Structure and Static Characteristicsmentioning
confidence: 96%
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“…It can be observed from Fig. 2 that the conventional IGBT-A shows non-saturated tendency of the Jc-Vce characteristics due to CIBL effect [7]. The CIBL mechanism can be explained as follows: during forward conduction, the whole mesa region becomes conductivity modulated, which is caused by the hole current flowing into the inversion layers and n + -cathode, as shown in Fig.…”
Section: Device Structure and Static Characteristicsmentioning
confidence: 96%
“…Most recent developments on trench gated IGBTs are focussed upon scaling down mesa regions sandwiched between the gates to reduce on-state losses by enhancing the injection enhancement (IE) effect [3][4][5][6]. However, the IGBTs with very narrow mesa suffer from poor short circuit robustness because of the collector induced barrier lowering (CIBL) effect [7,8], which occurs at the P-base/n + -cathode junction caused by the conductivity modulation in the channel inversion layers [9].…”
Section: Introductionmentioning
confidence: 99%
“…The self-clamping feature in the TCIGBT technology ensures that current saturation levels do not increase significantly as k increases. In contrast, the scaling work on IGBT technology suffers from the absence of current saturation, which is originated by the potential barrier lowering in the middle of mesa regions [8]. Fig.…”
Section: B I-v Characteristicsmentioning
confidence: 99%
“…The same effect is used in 1D scaling of mesa width [6], 2D and 3D scaling of cathode cells [3,4] as well as deep sub-micron designs [7]. However, the IE effect also results in non-saturation of the MOS channel current, leading to significant degradation of short circuit withstand capability [8,9]. During the short-circuit mode, devices need to sustain simultaneously high voltage and high current, causing a significant increase in the local device temperature due to high-power dissipation.…”
Section: Recommended For Publication By Associate Editormentioning
confidence: 99%
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