2021 IEEE 39th VLSI Test Symposium (VTS) 2021
DOI: 10.1109/vts50974.2021.9441038
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On the Reliability of In-Memory Computing: Impact of Temperature on Ferroelectric TCAM

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Cited by 22 publications
(11 citation statements)
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“…Details on our FinFET and FE calibrations are in [17], [18]. Note that to realize the effects of ferroelectric, a physicsbased model of FeFET [19] has been integrated within the BSIM-CMG, which is the industry standard compact model for the FinFET technology. In this work, the physical channel length is 21nm as provided in [20].…”
Section: A Fefinfet Device Modelingmentioning
confidence: 99%
“…Details on our FinFET and FE calibrations are in [17], [18]. Note that to realize the effects of ferroelectric, a physicsbased model of FeFET [19] has been integrated within the BSIM-CMG, which is the industry standard compact model for the FinFET technology. In this work, the physical channel length is 21nm as provided in [20].…”
Section: A Fefinfet Device Modelingmentioning
confidence: 99%
“…Further, their error modeling was static and did not model the connection between different applications and incorrect Hamming distance computations. Ni et al and Thomann et al used a Fe-TCAM block to calculate the Hamming distance in a analog way similar to this work (Ni et al, 2019;Thomann et al, 2021). Both assumed a clocked self-referenced sense amplifier (CSRSA) translating the discharge current into the temporal domain and finally digital values, but no such circuit was presented.…”
Section: Related Workmentioning
confidence: 99%
“…In (Ni et al, 2019;Thomann et al, 2021) a similar approach is used as in Imani et al (2017) with a CSRSA, which also translates the discharge rate into the temporal domain. In these two works the conversion of the analog result to a digital one is not discussed.…”
Section: Comparison With Related Workmentioning
confidence: 99%
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