35th Intersociety Energy Conversion Engineering Conference and Exhibit 2000
DOI: 10.2514/6.2000-3075
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On the reliability of dc-dc power converters

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“…1(b) illustrates the calculated temperature rise in the drift region of a unipolar power switch vs. power dissipated; these results further suggest that SiC material is far superior to GaN for high-power and high-temperature electronics applications. A compelling evidence to support localized failure in silicon power MOSFETs resulting from "hot spot" and "current filamentation" resulted from the single electron burnout (SEB) stress test proposed by Shenai [9]. In the SEB stress test circuit shown in the insert of Fig.…”
Section: Lessons Learned From Siliconmentioning
confidence: 99%
“…1(b) illustrates the calculated temperature rise in the drift region of a unipolar power switch vs. power dissipated; these results further suggest that SiC material is far superior to GaN for high-power and high-temperature electronics applications. A compelling evidence to support localized failure in silicon power MOSFETs resulting from "hot spot" and "current filamentation" resulted from the single electron burnout (SEB) stress test proposed by Shenai [9]. In the SEB stress test circuit shown in the insert of Fig.…”
Section: Lessons Learned From Siliconmentioning
confidence: 99%