On the Potential of Galinstan-Based Minichannel and Minigap Cooling

Hodes, Marc; Zhang, Rui; Lam, Lisa Steigerwalt; Wilcoxon, Ross; Lower, Nathan P.

doi:10.1109/tcpmt.2013.2274699

Cited by 78 publications

(51 citation statements)

References 27 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The practical interest lies in, e.g., the thermal management of electronics via microchannel cooling of microprocessors whereby transfer of heat from the solid substrate (silicon) to a liquid coolant is desired, with as little thermal resistance as possible. A significant portion of the total thermal resistance is the caloric resistance of the coolant attributable to the energy required to increase its bulk temperature as it flows through the microchannel (Tuckerman & Pease 1981;Hodes et al 2014;Lam et al 2015). The structured walls increase the mass flow rate, and thus decrease the caloric resistance.…”

Section: Introductionmentioning

confidence: 99%

Nusselt numbers for Poiseuille flow over isoflux parallel ridges accounting for meniscus curvature

2016

Self Cite

View full text Add to dashboard Cite

We investigate forced convection in a parallel plate-geometry microchannel with superhydrophobic walls consisting of a periodic array of ridges aligned parallel to the direction of a Poiseuille flow. In the de-wetted (Cassie) state, the liquid contacts the channel walls only at the tips of the ridges, where we apply a constant heat flux boundary condition. The subsequent hydrodynamic and thermal problems within the liquid are then analysed accounting for curvature of the liquid-gas interface (meniscus) using boundary perturbation, assuming a small deflection from flat. The effects of this surface deformation on both the effective hydrodynamic slip length and the Nusselt number are computed analytically in the form of eigenfunction expansions, reducing the problem to a set of dual series equations for the expansion coefficients which must, in general, be solved numerically. The Nusselt number quantifies the convective heat transfer, the results for which are completely captured in a single figure, presented as a function of channel geometry at each order in the perturbation. Asymptotic solutions for channel heights large compared to ridge period are compared to numerical solutions of the dual series. The asymptotic slip length expressions are shown to consist of only two terms, with all other terms exponentially small. As a result these expressions are accurate even for heights as low as half the ridge period, and hence useful for engineering applications.

show abstract

Section: Introductionmentioning

confidence: 99%

Nusselt numbers for Poiseuille flow over isoflux parallel ridges accounting for meniscus curvature

2016

Self Cite

View full text Add to dashboard Cite

show abstract

“…Therefore, for a prescribed pressure drop, Galinstan requires much larger flow channels, i.e., minichannels, that enable sufficiently high flow rates to minimize caloric thermal resistance. Zhang et al [4] validated the analytical work of Hodes et al [2] at low heat fluxes and characterized the performances of water-based microchannel and Galinstan-based minichannel heat sinks. The goal of this study was to validate the analytical work of Hodes et al [2] through an experimental investigation of a microchannel heat sink cooled with single-phase water at high heat fluxes and a minichannel heat sink cooled with Galinstan to validate the test setup.…”

Section: Introductionmentioning

confidence: 91%

“…Subsequent to this initial study, there have been numerous other investigations. Recently, Hodes et al [2] reviewed the literature and developed a first-order model that predicted that thermal resistance can be reduced by 23% and 40% by using optimal water-based microchannel and Galinstan-based minichannel heat sinks, respectively, under the same constraints imposed by Tuckerman and Pease [1].…”

Section: Introductionmentioning

confidence: 99%

“…Wilcoxon et al [3] demonstrated its use as a coolant in a three-layer FR-4 prototype that included an integrated magnetohydrodynamic pump, and achieved an effective thermal conductivity of 6000 W/(mK) while consuming less than 500 mW of electric power. Hodes et al [2] note that because the density of Galinstan is about 6 times that of water and viscosity is about 2.4 times that of water, it exhibits a relatively high flow resistance. This is exacerbated by the fact that the volumetric heat capacity (c p ) of Galinstan is about half that of water.…”

Section: Introductionmentioning

confidence: 99%

“…Thus, when Galinstan is the coolant, the caloric thermal resistance, 1/(ṁc p ), where ṁ is mass flow rate and c p is specific heat, is typically much higher than that for other liquids. Hence, a lower flow resistance design is required when the coolant is changed from water to Galinstan and design parameters, notably channel spacing, are significantly different from optimal geometries if water is the coolant [2]. Figure 1 provides plot of total thermal resistance (R t ) and convection thermal resistance (R conv ) versus streamwise channel length (L) for 1 cm-wide Galinstan-based minichannel and water-based microchannel heat sinks when H = 302 μm and Δp ch = 214 kPa, where Δp ch is the pressure drop across the heat sink.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

High heat flux, single-phase microchannel cooling

Zhang

Hodes

Lower

et al. 2014

2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)

Self Cite

View full text Add to dashboard Cite

Microchannel heat sinks are a relevant thermal management technology because the combination of surface area enhancement and small length scales results in low thermal resistance. Previously, a thermal resistance of 0.09°C/W was achieved when a heat flux of 790 W/cm 2 was imposed on a 1 cm  1 cm footprint portion of a 400 m-thick Si test specimen utilizing single-phase microchannel cooling. Water was driven through the assembly with a 214 kPa pressure difference [1]. Under the same constraints, we report experimental results in which a heat flux of 1002 W/cm 2 and thermal resistance of 0.071 o C/W have been achieved when water was the coolant. Preliminary results with a liquid metal minichannel heat sink are also reported and suggest that thermal resistances as low as 0.45 o C/W may be achieved under the same constraints. Nomenclature VariablesA Heat transfer surface area [m 2 ] c p Specific heat at constant pressure [J/(kgK)] D h Hydraulic diameter [m] f Darcy friction factor h Heat transfer coefficient [W/(m 2 K)] H Channel height [m] L Streamise length of channel [m] ṁ Mass flow rate [kg/s] Δp ch Pressure drop across heat sink [Pa] Δp exp Experimental overall pressure drop [Pa] Δp inlet Inlet contraction pressure loss [Pa] Δp exp_ave Averaged experimental overall pressure drop [Pa] Δp outlet Pressure difference across sudden expansion [Pa] q Heat dissipation [W] Q Flow rate [ml/min] R conv Convection thermal resistance [ o C/W] Re Reynolds number [u m D/] R t Total thermal resistance [(T max -T in )/q] [ o C/W] T in Inlet temperature of the fluid [K] T max Maximum temperature of on the heating element [K] u m Mean flow velocity [m/s]  Kinematic viscosity [m 2 /s]  Density [kg/m 3 ] Acronyms FZS Float Zone Silicon TiW Titanium Tungsten

show abstract

MEMS Heat Exchangers

Mathew

Weiss

2015

Materials and Failures in MEMS and NEMS

View full text Add to dashboard Cite

On the Potential of Galinstan-Based Minichannel and Minigap Cooling

Cited by 78 publications

References 27 publications

Nusselt numbers for Poiseuille flow over isoflux parallel ridges accounting for meniscus curvature

Nusselt numbers for Poiseuille flow over isoflux parallel ridges accounting for meniscus curvature

High heat flux, single-phase microchannel cooling

MEMS Heat Exchangers

Contact Info

Product

Resources

About