2001
DOI: 10.1034/j.1600-0692.2001.d01-36.x
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On the mechanism of liquid copper penetration into iron grain boundaries

Abstract: The penetration of liquid copper into iron grain boundaries has been experimentally analysed. During the penetration, Cu diffuses into the iron grains. In this case, a Kirkendall effect is created, leading to vacancies which diffuse to the grain boundaries where they condense. A grain boundary crack is formed, which will be filled with liquid Cu. The driving force for penetration of the Cu-liquid into the grain boundary is the condensation of vacancies and the surface/interface free energy change. A theoretica… Show more

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Cited by 41 publications
(19 citation statements)
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References 6 publications
(11 reference statements)
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“…The quantification of the amount of liquid phase for the 0.06 Sn alloy with or without annealing in N 2 , however, does not vary much, as shown in Figure 11, suggesting that the back-diffusion flux was indeed negligible for the time period in current experiments. Calculations based on the formulas in Fredriksson et al's article [52] with the interface concentrations in the current experiment assuming a binary diffusion process (either Cu or Sn play the major role) resulted in a much smaller width (~0.05 lm) and length (~50 lm) of the cracks than the experimental observation (Figures 6(b) and (c)). Moreover, no porosity was observed at the liquid-cFe interface in the grain boundary in the FIB results (Figure 7(b)).…”
Section: Condensation Of Vacancymentioning
confidence: 82%
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“…The quantification of the amount of liquid phase for the 0.06 Sn alloy with or without annealing in N 2 , however, does not vary much, as shown in Figure 11, suggesting that the back-diffusion flux was indeed negligible for the time period in current experiments. Calculations based on the formulas in Fredriksson et al's article [52] with the interface concentrations in the current experiment assuming a binary diffusion process (either Cu or Sn play the major role) resulted in a much smaller width (~0.05 lm) and length (~50 lm) of the cracks than the experimental observation (Figures 6(b) and (c)). Moreover, no porosity was observed at the liquid-cFe interface in the grain boundary in the FIB results (Figure 7(b)).…”
Section: Condensation Of Vacancymentioning
confidence: 82%
“…[51] Fredriksson et al [52] proposed that although liquid Cu diffused to cFe grain boundaries, the lateral diffusion of Cu through the grain boundaries could cause vacancies condensation, which was responsible for the propagation and broadening of the liquid layer in the grain boundaries. Although the impurity diffusivity of Sn in matrix Fe (2.10 9 10 À14 m 2 /s) is much faster than the selfdiffusivity of Fe (1.56 9 10 À15 m 2 /s) and the impurity diffusivity of Cu (2.66 9 10 À15 m 2 /s), [30] the interface concentration of Sn at the cFe side was expected to be small as shown in Figure 9(c), and therefore, the resulting back-diffusion flux of Sn is consequently small.…”
Section: Condensation Of Vacancymentioning
confidence: 99%
“…Swelling of Fe-Cu compacts during sintering at temperatures above the melting point of copper has been extensively studied during the past four decades [1][2][3][4][5]. The swelling mechanism accepted today is that liquid copper penetrates into iron interparticle boundaries, and leads to the swelling.…”
Section: Introductionmentioning
confidence: 99%
“…The rate of penetration of Cu is very slow when tensile stress does not exist. 13) But under tensile stress, the penetration proceeds at a much higher rate. McLean 14) proposed the following critical condition that the stress starts crack propagation by liquid embrittlement.…”
Section: Effects Of Elements On Microstructure Near Steel/scale Intermentioning
confidence: 99%