On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH – Enabling Robust and Reliable 3-D Interconnect/Integrated Circuit (IC) Technology

Tian, Tian; Morusupalli, Rao R.; Shin, Hyungcheol; Son, Hwa–Young; Byun, Kwang-Yoo; Joo, Young‐Chang; Caramto, R.; Smith, Larry; Shen, Y.-L.; Kunz, Martin; Tamura, Nobumichi; Budiman, Arief Suriadi

doi:10.1016/j.proeng.2015.09.242

Cited by 41 publications

(17 citation statements)

References 28 publications

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“…Upon finally breaking the silicon solar cells underneath them at much higher heights, both the HA-SSC membrane materials exhibit several crack lines on the silicon cells indicating highly dissipated impact energy and transfer of load to the sideways (evident from the crack lines at different angles on the surfaces of the silicon cells) as received by the silicon cells. These cracks appear to follow the preferred crystallographic directions of <110> associated with the weakest crystallographic planes of {111} in typical silicon monocrystalline wafers/solar cells, as has been widely reported in the literature for both PV and other silicon-based energy devices [ 38 , 39 , 40 , 41 , 42 , 43 , 44 , 45 ].…”

Section: Resultsmentioning

confidence: 68%

Impact-Resistant and Tough 3D Helicoidally Architected Polymer Composites Enabling Next-Generation Lightweight Silicon Photovoltaics Module Design and Technology

et al. 2021

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Lightweight photovoltaics (PV) modules are important for certain segments of the renewable energy markets—such as exhibition halls, factories, supermarkets, farms, etc. However, lightweight silicon-based PV modules have their own set of technical challenges or concerns. One of them, which is the subject of this paper, is the lack of impact resistance, especially against hailstorms in deep winter in countries with four seasons. Even if the front sheet can be made sufficiently strong and impact-resistant, the silicon cells inside remain fragile and very prone to impact loading. This leads to cracks that significantly degrade performance (output power) over time. A 3D helicoidally architected fiber-based polymer composite has recently been found to exhibit excellent impact resistance, inspired by the multi-hierarchical internal structures of the mantis shrimp’s dactyl clubs. In previous work, our group demonstrated that via electrospinning-based additive manufacturing methodologies, weak polymer material constituents could be made to exhibit significantly improved toughness and impact properties. In this study, we demonstrate the use of 3D architected fiber-based polymer composites to protect the silicon solar cells by absorbing impact energy. The absorbed energy is equivalent to the energy that would impact the solar cells during hailstorms. We have shown that silicon cells placed under such 3D architected polymer layers break at substantially higher impact load/energy (compared to those placed under standard PV encapsulation polymer material). This could lead to the development of novel PV encapsulant materials for the next generation of lightweight PV modules and technology with excellent impact resistance.

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Section: Resultsmentioning

confidence: 68%

Impact-Resistant and Tough 3D Helicoidally Architected Polymer Composites Enabling Next-Generation Lightweight Silicon Photovoltaics Module Design and Technology

et al. 2021

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“…The movement of the indenter into the specimen was recorded for each increment of displacement to obtain a load vs. displacement plot analogous to the results of the indentation experiments. Finite element modeling (FE) has proven to be an effective tool to elucidate the stress and damage evolution in applications where in-situ experimental observations are not possible, or when they are only theoretically possible, but in reality, almost impossible, or at least impractical [ 64 , 65 , 66 , 67 , 68 ].…”

Section: Methodsmentioning

confidence: 99%

Crystallographic Anisotropy Dependence of Interfacial Sliding Phenomenon in a Cu(16)/Nb(16) ARB (Accumulated Rolling Bonding) Nanolaminate

et al. 2022

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Nanolaminates are extensively studied due to their unique properties, such as impact resistance, high fracture toughness, high strength, and resistance to radiation damage. Varieties of nanolaminates are being fabricated to achieve high strength and fracture toughness. In this study, one such nanolaminate fabricated through accumulative roll bonding (Cu(16)/Nb(16) ARB nanolaminate, where 16 nm is the layer thickness) was used as a test material. Cu(16)/Nb(16) ARB nanolaminate exhibits crystallographic anisotropy due to the existence of distinct interfaces along the rolling direction (RD) and the transverse direction (TD). Nanoindentation was executed using a Berkovich tip, with the main axis oriented either along TD or RD of the Cu(16)/Nb(16) ARB nanolaminate. Subsequently, height profiles were obtained along the main axis of the Berkovich indent for both TD and RD using scanning probe microscopy (SPM), which was later used to estimate the pile-up along the RD and TD. The TD exhibited more pile-up than the RD due to the anisotropy of the Cu(16)/Nb(16) ARB interface and the material plasticity along the TD and RD. An axisymmetric 2D finite element analysis (FEA) was also performed to compare/validate nanoindentation data, such as load vs. displacement curves and pile-up. The FEA simulated load vs. displacement curves matched relatively well with the experimentally generated load–displacement curves, while qualitative agreement was found between the simulated pile-up data and the experimentally obtained pile-up data. The authors believe that pile-up characterization during indentation is of great importance to documenting anisotropy in nanolaminates.

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“…The applied loading in the above sections is uniform along the edges of the TSVs. However, the results from FEM simulation and experimental work reveal that strains in the TSVs exhibit heterogeneous distributions, i.e., a nonlinear distribution with higher strains occurring near the top end of TSVs [6,30]. To further investigate the protrusion behavior, nonuniform distributions of loading should be considered.…”

Section: The Distribution Of Loadingmentioning

confidence: 99%

Microstructural Evolution and Protrusion Simulations of Cu-TSVs Under Different Loading Conditions

Liu

Huang

Conway

2019

Journal of Electronic Packaging

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Thermal stress-induced protrusions of copper through-silicon-vias (Cu-TSVs) during thermal processing pose substantial reliability concerns in three-dimensional (3D) system integration. In this study, a phase-field-crystal (PFC) model is used to investigate the protrusions and microstructural evolutions of blind Cu-TSVs under different loading conditions. Protrusions are observed only when the TSVs are under εx, εy, and γxy, whereas no protrusions are observed when the TSVs are subjected to pure shear strains γyx. The simulation results suggest that the grains in the top layer of a TSV contribute more to both the protrusion profile and the protrusion height than the grains in the lower layers. Moreover, the protrusion is larger when the misorientation among the grains is larger and the grain size along the y-direction is smaller. In addition, a phenomenological model linking protrusion and microstructural factors and a visual guide from the viewpoint of plastic flow are provided to understand the origins of Cu-TSV protrusion.

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On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH – Enabling Robust and Reliable 3-D Interconnect/Integrated Circuit (IC) Technology

Cited by 41 publications

References 28 publications

Impact-Resistant and Tough 3D Helicoidally Architected Polymer Composites Enabling Next-Generation Lightweight Silicon Photovoltaics Module Design and Technology

Impact-Resistant and Tough 3D Helicoidally Architected Polymer Composites Enabling Next-Generation Lightweight Silicon Photovoltaics Module Design and Technology

Crystallographic Anisotropy Dependence of Interfacial Sliding Phenomenon in a Cu(16)/Nb(16) ARB (Accumulated Rolling Bonding) Nanolaminate

Microstructural Evolution and Protrusion Simulations of Cu-TSVs Under Different Loading Conditions

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