On the fracture behaviour of CFRP bonded joints under mode I loading: Effect of supporting carrier and interface contamination

Heide-Jørgensen, Simon; Freitas, Sofia Teixeira de; Budzik, Michal K.

doi:10.1016/j.compscitech.2018.03.024

Cited by 39 publications

(15 citation statements)

References 73 publications

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“…85 The same phenomenon has been observed with the contamination by mold release agents. 79,86,87 The effect of contaminants on adhesive bonds is a highly complex subject of study, since it will depend on the contaminant, adhesive, substrate and interactions between them. However, two major and different behaviors of the contaminant can be identified.…”

Section: Effect Of Contamination On the Interfacial Propertiesmentioning

confidence: 99%

“…Debonds contribute to unstable crack growth, decreasing the load capacity of the joint. 87 As debonds are areas where there is no connection between the adhesive and the substrate, they will create preferential paths for fracture propagation, contributing to the adhesive failure of the joint, also decreasing its strength, possibly with catastrophic consequences if a sufficiently large area of the joint is affected. 79 As the consequences of contamination will be very much dependent on the materials and study conditions, the resultant effects are quite complex, and each case can exhibit particularly different effects.…”

Section: Effect Of Contamination On the Interfacial Propertiesmentioning

confidence: 99%

“…The analytical model of the weak interface consists of a beam, where the areas with adhesive are modelled by springs. In an additional study, Heide-Jørgensen et al 87 studied the mode I fracture behavior of adhesive joints with CFRP substrates, bonded with an epoxy film adhesive, with and without debonds along the crack propagation path, using DCB tests. The debond was introduced through the placement of a release film on the surface of the CFRP while curing and promoted unstable crack growth.…”

Section: Contaminationmentioning

confidence: 99%

See 2 more Smart Citations

Review on the effect of moisture and contamination on the interfacial properties of adhesive joints

Borges

Marques

Carbas

et al. 2020

Proceedings of the Institution of Mechanical Engineers, Part C:

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Adhesives play an important role in many key industrial sectors, such as the automotive industry, enabling the construction of lightweight, multi-material structures, combining polymers, composites and metals. However, adhesives are usually polymeric materials, which can be affected by environmental and working conditions, such as moisture and contamination. Although moisture and contamination degrade the adhesive, the failure of a bonded joint is often ultimately interfacial. Therefore, a literature review on the influence of those factors on the interfacial properties of adhesive joints is performed to understand the phenomena that take part in the degradation on adhesive joints when subjected to humid and contaminated environments, which can oftentimes be the case in factory conditions, especially for parts from third-party suppliers. The mechanisms and effects of moisture aging and contamination are presented, as well as experimental testing methods and practical case studies. It is concluded that both moisture and other contaminants may lead to a reduction in joint strength and catastrophic adhesive failure. Moisture absorption can occur through the adhesive, but in an adhesive joint, it can additionally occur through the substrate, the interface between the adhesive and the substrate or in the cracks and pores of the adhesive. After water ingresses into the adhesive, it decreases its mechanical properties and plasticizes it. However, in an adhesive joint, the water diffusion occurs much faster than in bulk adhesive due to the complementary diffusion paths, which typically leads to adhesive failure at the adhesive/substrate interface. Additionally, in an adhesive joint, water may induce the hydrolysis of the substrates or have other chemical interactions with them. Contaminants can diffuse through the joint or remain at the adhesive/ substrate interface. When they diffuse through the joint, they have consequences similar to those of water sorption. However, when they remain at the interface, they can produce locally debonded areas, which may lead to joint failure.

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Section: Effect Of Contamination On the Interfacial Propertiesmentioning

confidence: 99%

Section: Effect Of Contamination On the Interfacial Propertiesmentioning

confidence: 99%

Section: Contaminationmentioning

confidence: 99%

See 1 more Smart Citation

Review on the effect of moisture and contamination on the interfacial properties of adhesive joints

Borges

Marques

Carbas

et al. 2020

Proceedings of the Institution of Mechanical Engineers, Part C:

View full text Add to dashboard Cite

show abstract

“…The current approaches of using film insertions, [4,13,27] "pillow" insertions [4,15,21], contaminants [4,8,9,12,15,16,21,28], uncured resin [13], pull tabs [4,9] or electrically de-bonding adhesives [12] have several limitations in accurately simulating kiss-bonds, and can lead to misleading results. For example, Chen et al [13] used film insertions and uncured resin to simulate delamination and kiss-bonds.…”

Section: Current Approachesmentioning

confidence: 99%

A novel method to produce kiss-bonds in composites components for NDI and characterisation purposes

Telford

O'Carroll

Pierce

et al. 2019

Composites Part B: Engineering

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Kiss-bonds (kissing bonds) are a defect type that feature a localised loss of structural continuity within the material, yet the material remains in intimate contact across the defect. Typically, shear and normal tensile stresses cannot be conducted across such defects (although, pure compressive stresses are possible). Kiss-bond defects are difficult to detect reliablyboth within the bulk of the material (interlaminar) and within bond-lines of adhesively bonded joints or repairsusing conventional Non-Destructive Inspection (NDI) techniques. Compounding this issue is the lack of a reliable technique to create representative kiss-bond defects in a controlled fashion for the purpose of NDI equipment calibration or development, or scientific investigation.A novel method for manufacturing composite material test panels with kiss-bond defects (for research or NDI calibration, for example) in a controlled and repeatable fashion has been developed. Small areas of two adjacent pre-preg plies were pre-cured before being incorporated within a laminate. During consolidation, no bonding occurs between the pre-cured areas, thus creating a kiss-bond defect of known geometry. Test panels with 6x6 mm and 10x10 mm kiss-bond defects were manufactured. The robustness of the technique was verified using ultrasonic and laser shearography NDI methods; 7 of the 10 manufactured defects were classified as kiss-bonds, with the remaining 3 identified as dis-bonds.

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“…The R-curve response associated with the extrinsic bridging phenomena was also reported in Refs. [16,17], where the adhesive layer was reinforced by either a plastic or metallic carrier. Heide-Jørgensen et al analyzed the R-curve due to bridging of a nylon carrier embedded in a commercial epoxy adhesive film to set the layer thickness, and found a significant toughness enhancement [16].…”

Section: Introductionmentioning

confidence: 99%

On controlling interfacial heterogeneity to trigger bridging in secondary bonded composite joints: An efficient strategy to introduce crack-arrest features

Tao

Yudhanto

et al. 2020

Composites Science and Technology

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On the fracture behaviour of CFRP bonded joints under mode I loading: Effect of supporting carrier and interface contamination

Cited by 39 publications

References 73 publications

Review on the effect of moisture and contamination on the interfacial properties of adhesive joints

Review on the effect of moisture and contamination on the interfacial properties of adhesive joints

A novel method to produce kiss-bonds in composites components for NDI and characterisation purposes

On controlling interfacial heterogeneity to trigger bridging in secondary bonded composite joints: An efficient strategy to introduce crack-arrest features

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