2019
DOI: 10.1016/j.sse.2018.12.005
|View full text |Cite
|
Sign up to set email alerts
|

On the extraction of resistivity and area of nanoscale interconnect lines by temperature-dependent resistance measurements

Abstract: Several issues concerning the applicability of the temperature coefficient of the resistivity (TCR) method to scaled interconnect lines are discussed. The central approximation of the TCR method, i.e. the substitution of the interconnect wire TCR by the bulk TCR becomes doubtful when the resistivity of the conductor metal is strongly increased by finite size effects. Semiclassical calculations for thin films show that the TCR deviates from bulk values when the surface roughness scattering contribution to the t… Show more

Help me understand this report
View preprint versions

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

0
5
1

Year Published

2020
2020
2024
2024

Publication Types

Select...
8

Relationship

1
7

Authors

Journals

citations
Cited by 15 publications
(7 citation statements)
references
References 56 publications
0
5
1
Order By: Relevance
“…For example, it was hypothesized that softening occurs for surface phonon modes, leading to reduced Debye temperatures. 49,50,57,61 This is, however, inconsistent with the mechanical property measurement of silver nanowires documenting significant elastic stiffening with enhanced Young's moduli.…”
Section: 𝐹"𝑤 ℎ 𝑙contrasting
confidence: 63%
“…For example, it was hypothesized that softening occurs for surface phonon modes, leading to reduced Debye temperatures. 49,50,57,61 This is, however, inconsistent with the mechanical property measurement of silver nanowires documenting significant elastic stiffening with enhanced Young's moduli.…”
Section: 𝐹"𝑤 ℎ 𝑙contrasting
confidence: 63%
“…The product of the electron mean free path and the bulk resistivity is assumed to be independent of temperature as it is a function of the morphology of the Fermi surface; thus, the product of l r T T 0 ( ) ( ) is taken as a constant value (Mayadas et al 1969, Adelmann 2019, Siniscalchi et al 2020.…”
Section: Resultsmentioning
confidence: 99%
“…Consideration of metallic film TCR is also germane to the performance of scaled integrated circuits, which are subject to reduced feature sizes and increased power densities (Baklanov et al 2014, Ren et al 2018. A number of prior works have investigated thickness effects on the temperature coefficient of thin metal films, including, for example, (Zhang et al 2004, Camacho and Oliva 2006, Zhang et al 2006, Chuang et al 2016, Adelmann 2019, Siniscalchi et al 2020. The size dependence of the electrical properties of Cu have been of particular interest as scaling of interconnect lines poses future challenges to overall device and circuit performance (King 2014, Misják et al 2014, Dutta et al 2017a, Croes et al 2018, Debroy et al 2020.…”
Section: Introductionmentioning
confidence: 99%
“…Incorporating the influence of temperature, Equation (15) transforms to Equation (16) [ 57 ]. T is temperature.…”
Section: Resultsmentioning
confidence: 99%