On the Effect of Counterface Materials on Interface Temperature and Friction Coefficient of GFRE Composite Under Dry Sliding Contact

Abstract

Nowadays, there is an increase interest in polymeric composite materials for highperformance in many industrial applications. In other words, the tribo-studies on polymeric materials are growing fast to enhance the polymeric products such as bearings, seals, ring and bushes. The current work presents an attempt to study the correlation between the type of counterface material and frictional heating at the interface surfaces for different, normal loads (23N, 49N and 72N), sliding velocities (0.18, 1.3 and 5.2 m s¯1) and interval time (0-720 sec). Sliding friction experiments are performed on a pin-on-ring (POR) tribometer under dry contact condition. Interface temperature and friction force were measured simultaneously during sliding of glass fiber reinforced epoxy (GFRE) composite against three different counter face materials, hardened steel (HS), cast iron (CI) and Aluminum alloy (Al). Experimental results showed that the type of counterface material greatly influences both interface temperature and friction coefficient. Higher temperature and friction coefficient were evident when sliding took place against HS surface, compared to sliding against CI and Al under same condition. When sliding took place against HS, the friction coefficient of GFRE composite was about an order of magnitude higher than sliding the GFRE composite against the other counter face materials. Based on the optical microscope graphs, the friction and induced temperature results of GFRE composite are analyzed and discussed.

Morphological Characteristics and Wear Mechanism of Recycled Carbon Fibre Prepreg reinforced Polypropylene Composites

“…The transition from 3 to 5 wt% loadings could be considered the threshold at which the composites developed a self-lubricating mechanism [3]. The self-lubricating properties of this system are believed to be primarily due to its ability to deposit a thin protective layer of polymer onto the counterface referred to as transfer film [3,16] and the formation of the polymer patch film on composites [3,14]. Due to the weaker interaction between fibre and matrix, an early stable transfer film formed.…”

“…It demonstrates that the dominant mechanisms for enhancing tribological performance in the presence of hard submicron-particles are unrelated to the type of carbon fibres used to reinforce the composite. Additionally, the patch film on the composites served as a separator at the interface, with its low thermal conductivity reducing the effect of temperature and thus the friction coefficient [14].…”

Dry Sliding Friction and Wear Behaviour of Reinforced Hybrid Composites of Uniaxial Glass Fiber with Silicon Carbide, Aluminium Oxide and Graphite

“…Composites may be preferred for many reasons: common examples include materials which are stronger, lighter, or less expensive when compared to traditional materials. The most advanced examples perform routinely on spacecraft and aircraft in demanding environments [1][2][3]. According to Robert M. Jones [4], if the composite material is well designed, they usually exhibit the best qualities of their components and often qualities that neither of the constituent possesses.…”

Thermal properties of carbon nanofiber reinforced high-density polyethylene nanocomposites

“…6 In tribological applications, the primary failure mechanism in polymeric friction and wear materials is polymer degradation induced by temperature rise at the frictional surface. 7 Improving polymer's thermal conductivity is deemed to be a promising engineering approach to increase the frictional heat dissipation and thus result in significantly lower surface temperature on the polymer body. In the electronic packaging industry, the heat dissipation controlled by thermal conductivity is a critical issue to performance and reliability since the miniaturization and increase of power density of integrated circuits of microelectronics have led to an escalation of heat flux in the devices.…”