On the Direct Extrusion of Solder Wire from 52In-48Sn Alloy

Abstract

In this article, technology for producing wire and rod solder from 52In-48Sn alloy has been developed and investigated in the conditions of small-scale production. The use of direct extrusion of wire and rods instead of traditional technology for producing solder, which includes pressing, rolling and drawing, can significantly reduce the fleet of required equipment. Using only a melting furnace and a hydraulic press, solder wires and rods can be produced in various sizes. Shortening the production cycle allows you to quickly fulfill small orders and be competitive in sales. This article develops a mathematical model of direct extrusion, which allows you to calculate the extrusion ratio, extrusion speed and pressing force. The results of modeling the process of extrusion of wire Ø2.00 mm and rods Ø8.0 mm made of 52In-48Sn alloy are presented. The temperature of the solder and the tool is simulated in software QForm based on the finite element method. Experimental results of manufacturing Ø2.0 mm solder wire and Ø8.0 mm rods are presented. The microstructure of the direct extruded solder is a eutectic of phases γ and β. Energy-dispersive X-ray spectroscopy (EDS) mapping of the 52In-48Sn alloy showed that the solder obtained by direct extrusion has a uniform distribution of structural phases. The developed technology can be used in the manufacture of wires and rods from other low-melting alloys.

Recycling Aluminium AA6061 Chips with Reinforced Boron Carbide (B4C) and Zirconia (ZrO2) Particles via Hot Extrusion

“…Hence, measuring grains exhibited the thin film's polycrystalline structure dependents of ceramic particles to the aluminium chips, as presented in Figure 8. The thin films To estimate the distribution of chemical elements, energy-dispersive X-ray spectroscopy (EDS) was conducted, which has been a widely applied technique [46]. The X-ray spectroscopy results showing the distribution of material chemical elements are presented in Figure 9 and Table 7.…”

Investigation of Structures, Stability, and Electronic and Magnetic Properties of InnSnnClusters Using Density‐Functional Theory

“…[ 1–7 ] In–Sn alloys are also essential components of lead‐free solder in microelectronics, such as In–Sn, Bi–In–Sn, Sn–Ag–In, Sn–In–Zn, Sn–In–Ag–Bi, Sn–In–Ag–Sb, Sn–Zn–In–Sb, Sn–Zn–In–Bi, and Sn–Zn–In–Ag. [ 8–16 ] However, indium resources worldwide are estimated to be only 50 000 tons. However, approximately 19 000 tons of coal can be mined.…”

Study on the Application of Modified Sn-Based Solder in Cable Intermediate Joints

“…The new elements added to the tin-based system should meet some basic requirements [ 19 , 20 , 21 ], such as reducing the surface tension of the solder to improve its wettability, mechanical properties (e.g., mechanical fatigue, vibration, impact, and shear), and electrical properties (e.g., electrical conductivity and contact resistance). In order to solve the above problems, the soft brazing technology is based on Sn-Zn [ 22 ] and Sn-Cu [ 23 ] and adds materials such as Bi [ 24 ], In [ 25 ], and Ga [ 26 ] to improve the properties of the solder. However, most of the research on solder is more inclined to the field of electronic packaging and cannot be well applied to power cable connections.…”