Abstract:The high-volume manufacturing of the next generation of semiconductor devices requires advances in measurement signal analysis. Many in the semiconductor manufacturing community have reservations about the adoption of deep learning; they instead prefer other model-based approaches for some image regression problems, and according to the 2021 IEEE International Roadmap for Devices and Systems (IRDS) report on Metrology a SEMI standardization committee may endorse this philosophy. The semiconductor manufacturing… Show more
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