2002
DOI: 10.1143/jjap.41.l226
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On the Carrier Concentration and Hall Mobility in GaN Epilayers

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Cited by 23 publications
(10 citation statements)
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“…Similarly, in the communication phase, defining the synchronization error yields (8) Furthermore, according to Fig. 2, the recovered signal is achieved by (9) and, by using (9), we have of the transmitted information signal s(t) and the error between and information single and the recovery signal, respectively. The above simulations confirm that the proposed scheme operates satisfactorily.…”
Section: Application To Secure Communicationmentioning
confidence: 99%
“…Similarly, in the communication phase, defining the synchronization error yields (8) Furthermore, according to Fig. 2, the recovered signal is achieved by (9) and, by using (9), we have of the transmitted information signal s(t) and the error between and information single and the recovery signal, respectively. The above simulations confirm that the proposed scheme operates satisfactorily.…”
Section: Application To Secure Communicationmentioning
confidence: 99%
“…[13][14][15][16][17][18][19][20][21][22][23][24][25][26][27] Briefly, trimethylaluminum, trimethylgallium, trimethylindium, and ammonia were used as aluminum, gallium, indium, and nitrogen sources, respectively. Biscyclopentadienyl magnesium (CP 2 Mg) and disilane (Si 2 H 6 ) were used as the p-type and n-type doping sources, respectively.…”
Section: Methodsmentioning
confidence: 99%
“…Conventional nitridebased LEDs use semitransparent Ni/Au on Mgdoped GaN as the p-contact material. [1][2][3][4] However, the operation voltage of such LEDs is still high because of the low Mg-ionization percentage. The low Mg-ionization percentage will result in a highly resistive top p-GaN layer and a large metal/p-GaN contact resistance in nitride-based LEDs.…”
Section: Introductionmentioning
confidence: 99%
“…Details of the growth conditions can be found elsewhere. [9][10][11][12][13][14][15][16][17] The InGaN/GaN MQW LED structure consists of a 30-nm-thick, GaN-nucleation layer grown at a low temperature of 560°C; a 4-mthick, Si-doped, n-GaN-cladding layer; an InGaN/ GaN MQW active region; a 50-nm-thick, Mg-doped, p-Al 0.15 Ga 0.85 N-cladding layer; and a 0.25-m-thick, Mg-doped, p-contact layer. The InGaN/GaN MQW active region consists of five pairs of 3-nm-thick, In 0.05 Ga 0.95 N-well layers and 12-nm-thick, GaNbarrier layers.…”
Section: Methodsmentioning
confidence: 99%