On Superdeep Penetration of a Multiparticle Flux and Damage of Electronic Elements Positioned behind an Obstacle

Breakthrough of a composite obstacle by high-velocity particles as a result of realization of the superdeep-penetration effect

“…It is shown that the penetration process can be controlled, in principle.In [1][2][3], the results of experiments on breakthrough of a steel obstacle of thickness 100-200 mm by high-velocity microparticles in the regime of superdeep penetration are presented. After the collision of a particle flux with an obstacle, traces of the material of the particles and of the obstacle were detected on the surface of thin aluminum, copper, or plastic foils packed in a stack of 30-40 foils positioned downstream of the obstacle [1].…”

“…After the collision of a particle flux with an obstacle, traces of the material of the particles and of the obstacle were detected on the surface of thin aluminum, copper, or plastic foils packed in a stack of 30-40 foils positioned downstream of the obstacle [1]. It was established that, when an integrated circuit is placed downstream of an obstacle, its case (cover) is broken and the crystal is damaged [2, 3].The superdeep-penetration effect is also realized when a flux of microparticles collides with fluoroplastic or aluminum obstacles [4]. The effectiveness of penetration, determined by the total number of penetrated particles per unit area of foils positioned downstream of an obstacle, is higher for fluoroplastic than for aluminum.…”

“…After the collision of a particle flux with an obstacle, traces of the material of the particles and of the obstacle were detected on the surface of thin aluminum, copper, or plastic foils packed in a stack of 30-40 foils positioned downstream of the obstacle [1]. It was established that, when an integrated circuit is placed downstream of an obstacle, its case (cover) is broken and the crystal is damaged [2, 3].…”