On-machine wire electrical discharge dressing (WEDD) of metal-bonded grinding wheels

Weingärtner, Eduardo; Jaumann, Sascha; Kuster, Friedrich; Wegener, Konrad

doi:10.1007/s00170-009-2458-0

Cited by 19 publications

(6 citation statements)

References 19 publications

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“…In terms of wheel surface microtopography, it is possible to provide an effective grain protrusion by using WEDC, as the discharge process does not influence the generally non-conductive abrasive grains. Within a conventional mechanical conditioning on the other hand, the abrasive grains undergo a significant flattening or a complete pullout, neither of which is desirable for the chip formation process during grinding [10][11][12]. Therefore, WEDC provides sharper abrasive grains and leads to the reduction of grinding forces and consequently to a lower wheel wear [11].…”

Section: Introductionmentioning

confidence: 99%

Grinding efficiency and profile accuracy of diamond grinding wheels dressed with wire electrical discharge conditioning (WEDC)

Zahedi¹,

Khosravi²,

Azarhoushang³

2021

Int J Adv Manuf Technol

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Super abrasive diamond grinding wheels are the most promising tools for the precision machining of advanced ceramics and carbide materials. However, the efficiency of conventional conditioning of these tools is limited owing to high dressing tool wear, long process time, low form flexibility, and induced damage to the abrasive grains. Wire electrical discharge machining (WEDM) is an alternative method for conditioning of superabrasive grinding wheels with electrically conductive bonding materials. In this study, cylindrical plunge grinding of an alumina ceramic with a resin-bonded diamond grinding wheel is investigated. The assigned type of resin bond contains copper particles and is accordingly electrically conductive for wire electrical discharge conditioning (WEDC). Conventional (mechanical) and WEDC methods are used for generating the same profile on two similar diamond grinding wheels. As a result, the specific grinding energy was reduced up to 26% and 29% during rough and finish plunge grinding, respectively. Reduced specific grinding energy and forces, along with more effective grain protrusion and sharpness by using WEDC for profiling of grinding wheels, have contributed positively to the ground surface conditions despite the relatively rougher wheel surface topography in comparison to the conventional profiling. The more considerable reduction in the mean roughness depth (Rz) than in the arithmetical mean roughness value (Ra) (11% smaller Rz values in WEDC versus mechanical conditioning) verifies that the workpiece surface underwent less surface degradation in case of WEDC because of smaller grinding forces. Furthermore, the profile wear behavior of the workpiece ground with the WED conditioned grinding wheel was superior to the conventionally conditioned one.

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Section: Introductionmentioning

confidence: 99%

Grinding efficiency and profile accuracy of diamond grinding wheels dressed with wire electrical discharge conditioning (WEDC)

Zahedi¹,

Khosravi²,

Azarhoushang³

2021

Int J Adv Manuf Technol

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“…One particular application is found in grinding high performance ceramics. Metal bounded diamond wheels are widely applied in this case, since it perfectly combines the hardness of diamond grains with the wear resistance of metal bonds [3,4]. When it comes to conditioning, however, the above mentioned advantages are turned into disadvantages.…”

Section: Introductionmentioning

confidence: 99%

“…To overcome this problem, different dressing methods have been proposed, e.g. die-sinking and wire electrical discharge machining, which can be used for dressing metal bonded diamond wheels, since the electrically conductive bond is removed and the diamonds, which are electric insulators, cannot be eroded [4,5]. This selective removal process is of great importance for grinding, since the dressing process has to provide the grinding wheel with sufficient grain protrusion and chip space, which is important for collecting ground chips and for improving the cutting fluid transportation through the grinding zone.…”

Section: Introductionmentioning

confidence: 99%

“…In spite of that, different studies have shown that electric discharge machining is a suitable dressing process for metal bounded diamond wheels. Weingärtner et al [4] stated that, in comparison to SiC-dressed diamond wheels, lower grinding forces are generated and better G-ratios are achieved when a wire electrical discharge dressed wheel was applied for grinding silicon nitride workpieces. Rhoney et al [8] also successfully applied wire electrical discharge machining for conditioning metal bonded diamond wheels for grinding ceramics.…”

Section: Introductionmentioning

confidence: 99%

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Electrical discharge dressing and its influence on metal bonded diamond wheels

et al. 2012

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Although EDM is a thermal removal process, when it is applied for dressing diamond grinding wheels, usually little or no thermal damage is caused to the diamonds. In this work, a better explanation for this fact is provided. A thermo-electrical model is used to calculate the temperature distribution inside diamonds showing that even for high discharge energies small amount of graphitization occur. Here, the exceptional properties of diamond contribute to minimize thermal damages. Still, a concentration of discharges can occur around the diamonds and thus lead to thermal damages. However, this phenomenon is more evident for large diamonds.Wire EDM, Dressing, Diamond.

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“…Należą do nich m.in. profilometria optyczna [4], interferometria światła białego [5], mikroskopia konfokalna [6], mikroskopia różnicowania ogniskowego [7]. Ważną grupą metod optycznych są również metody wykorzystujące zjawisko rozpraszania światła [8].…”

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The analysis of scattered light on surface of monolayer abrasive bulk materials with abrasive grains type Trizact™

2015

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KEYWORDS: Light scattering, light scattering methods, image processing and analysis, monolayer abrasive bulk materials, abrasive grains Trizact™ WprowadzenieStan czynnej powierzchni narzędzi ściernych jest waż-nym czynnikiem warunkującym prawidłowy przebieg i uzyskane rezultaty procesu obróbkowego. Wykrywanie wykruszeń i starć ziaren ściernych oraz lokalizacja i analiza zalepień materiałem obrabianym musi być odpowiednio oceniana. Zagadnieniom szeroko pojętej oceny stanu narzędzi ściernych od wielu lat poświęca się wiele uwagi, na co wskazują liczne prace z tego zakresu [1][2][3]. W wielu z nich wymienia się różnego rodzaju metody pomiarowe mogące mieć zastosowanie w tego typu ocenie. Autorzy prac zgodnie podkreślają duże ograniczenia w odniesieniu do pomiarów narzędzi ściernych metodami stykowymi, a jako najkorzystniejsze, w tym przypadku, wymieniają metody optyczne. Ze stosunkowo szerokiej grupy metod optycznych można wydzielić wiele technik mogących mieć zastosowanie w ocenie stanu powierzchni takich narzędzi. Należą do nich m.in. profilometria optyczna [4], interferometria światła białego [5], mikroskopia konfokalna [6], mikroskopia różnicowania ogniskowego [7]. Ważną grupą metod optycznych są również metody wykorzystujące zjawisko rozpraszania światła [8]. Są one z powodzeniem wykorzy-* Dr inż. Wojciech Kapłonek (wojciech.kaplonek@tu.koszalin.pl), Dr hab. inż. Krzysztof Nadolny (krzysztof.nadolny@tu.koszalin.pl), Mgr inż.

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On-machine wire electrical discharge dressing (WEDD) of metal-bonded grinding wheels

Cited by 19 publications

References 19 publications

Grinding efficiency and profile accuracy of diamond grinding wheels dressed with wire electrical discharge conditioning (WEDC)

Grinding efficiency and profile accuracy of diamond grinding wheels dressed with wire electrical discharge conditioning (WEDC)

Electrical discharge dressing and its influence on metal bonded diamond wheels

The analysis of scattered light on surface of monolayer abrasive bulk materials with abrasive grains type Trizact™

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