2008
DOI: 10.1143/apex.1.011401
|View full text |Cite
|
Sign up to set email alerts
|

On Effects of Gate Bias on Hole Effective Mass and Mobility in Strained-Ge Channel Structures

Abstract: The effects of gate bias on hole effective mass (m*) and Hall mobility were studied in strained-Ge channel modulation-doped structures. Shubnikov–de Haas oscillations were analyzed with and without the bias and a significant m* increase from 0.15 to 0.22 m0 was observed with the increase in the carrier density due to the strong nonparabolicity of the valence band. This is a clear demonstration that modification of carrier density via gating considerably affects m*, which may have critical effects on device pro… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
1
0

Year Published

2009
2009
2016
2016

Publication Types

Select...
5

Relationship

0
5

Authors

Journals

citations
Cited by 5 publications
(1 citation statement)
references
References 12 publications
0
1
0
Order By: Relevance
“…Biaxial global-strain-type strained Si (s-Si) formed on a Si 1Àx Ge x strain-relief relaxed buffer has been intensively applied to high-electronmobility transistors such as modulation-doped field-effect and metal-oxide-semiconductor transistors. [1][2][3][4][5] However, when we form global-strain-type s-Si by currently used gas-source methods such as gas-source molecular beam epitaxy (GS-MBE) and chemical vapor deposition (CVD), a crosshatch undulation pattern is generally formed on the surface with an undulation pitch of typically less than 1 m. 6) This surface undulation causes a nonuniform strain distribution 7) and variations in the physical properties and device performance on the surface. This is a serious issue to be solved for smaller and higher-density devices.…”
mentioning
confidence: 99%
“…Biaxial global-strain-type strained Si (s-Si) formed on a Si 1Àx Ge x strain-relief relaxed buffer has been intensively applied to high-electronmobility transistors such as modulation-doped field-effect and metal-oxide-semiconductor transistors. [1][2][3][4][5] However, when we form global-strain-type s-Si by currently used gas-source methods such as gas-source molecular beam epitaxy (GS-MBE) and chemical vapor deposition (CVD), a crosshatch undulation pattern is generally formed on the surface with an undulation pitch of typically less than 1 m. 6) This surface undulation causes a nonuniform strain distribution 7) and variations in the physical properties and device performance on the surface. This is a serious issue to be solved for smaller and higher-density devices.…”
mentioning
confidence: 99%