2013 International Workshop on Antenna Technology (iWAT) 2013

DOI: 10.1109/iwat.2013.6518332

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Off-chip antenna designs for fully integrated, low-cost millimeter-wave transceivers

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Benjamin Göttel

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Christian Rusch

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et al.

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Cited by 3 publications

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Integrated mm-wave sensors in a package

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2013

2013 Asia-Pacific Microwave Conference Proceedings (APMC)

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Integrated mm-wave sensors in a package

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²

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³

2013

2013 Asia-Pacific Microwave Conference Proceedings (APMC)

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High-Gain Millimeter-Wave Holographic Antenna in Package Using Glass Technology

Frey²,

et al. 2020

Antennas Wirel. Propag. Lett.

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A novel concept for a holographic antenna-in-package (AiP) is presented enabling the seamless integration of high gain antennas at millimeter wave frequencies. The antenna is based on a holographic impedance approach stimulating a leaky wave mode at 150 GHz. Since the antenna structure is placed on top of the glass package, a large antenna aperture with high angular beam width and efficiency were achieved. The surface wave launcher (SWL) of the antenna connected to the integrated active circuitry is designed in a very compact fashion using a vertical through-glass-via (TGV) and solder balls. The performance of the proposed holographic antenna package has been investigated by an analytic model and full wave simulations. The measurement results of the antenna prototype on glass using anisotropic unit cells show excellent agreement to the simulated values. A maximum gain of 24.7 dBi, a sidelobe level of 15 dB, and a 3 dB-beam width of 4.7 • are achieved. The measured 3D-radiation pattern shows a highly directive pattern in all cuts.

A Transmitter System-in-Package at 300 GHz With an Off-Chip Antenna and GaAs-Based MMICs

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et al. 2019

IEEE Trans. THz Sci. Technol.

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