2007
DOI: 10.1134/s1023193507010053
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Of the mechanism governing the growth of electrolessly deposited nickel-phosphorus coatings

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Cited by 7 publications
(8 citation statements)
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“…The SEM pictures show larger hemispheres or spheroids that for the coating from Bath‐I revealing amorphous nature. Thus, depending on the concentration of non‐metallic component P, chemically deposited nickel coatings exhibit different microstructure (Petakhov, 2007). To summarize, amorphous structure could not be obtained as no sufficient P atoms are present to distort the nickel lattice to such an extent that amorphous nickel could be obtained with respect to the non‐amorphous deposit obtained from Bath‐II.…”
Section: Discussionmentioning
confidence: 99%
“…The SEM pictures show larger hemispheres or spheroids that for the coating from Bath‐I revealing amorphous nature. Thus, depending on the concentration of non‐metallic component P, chemically deposited nickel coatings exhibit different microstructure (Petakhov, 2007). To summarize, amorphous structure could not be obtained as no sufficient P atoms are present to distort the nickel lattice to such an extent that amorphous nickel could be obtained with respect to the non‐amorphous deposit obtained from Bath‐II.…”
Section: Discussionmentioning
confidence: 99%
“…The primary purpose of the complexing agents is to reduce the formation of copper to copper hydroxides (Cu(OH) 2 ) during the process. 39–41…”
Section: Experimental Workmentioning
confidence: 99%
“…The primary purpose of the complexing agents is to reduce the formation of copper to copper hydroxides (Cu(OH) 2 ) during the process. [39][40][41] Having completed the plating process, the next step was the post-treatment process. At this stage, copperplated fabric samples were rinsed with distilled water at 40 C for 20 minutes by electric automatic controlled temperature heaters IKA C-MAG HS7 and IKA ETS-D5.…”
Section: Fabrication Of the Conductive Fabricsmentioning
confidence: 99%
“…Electroless or autocatalytic metal deposition is a process in which reduction of metal ions and oxidation of a reducing agent take place simultaneously at a catalytic surface. The mechanisms of electroless plating of Ni-P, Cu, and Ag were systematically discussed [2][3][4]. In the previous study, the properties of electromagnetic shielding of electroless Ni-P [5][6][7], Cu [8][9][10][11][12][13], Ag [14][15][16], Ni-Cu-P, and Cu-Ni-P [17,18] plating on polymer substrates were extensively studied.…”
Section: Introductionmentioning
confidence: 99%