Observations on persistent slip bands transferring through a grain boundary in a copper bicrystal by the electron channelling contrast in scanning electron microscopy technique

Co-Cr-Ni-Mo wires for medical applications : processing, mechanical, microstructure and fatigue characterization

“…HAGB are known to be effective obstacles to the dislocation motion [174,376], thus increasing the strength of the material, but they also act as preferential sites for crack nucleation with the increased stress amplitude due to the rise in the stress incompatibility of the material. However, the LAGB [377,378], allow the dislocations to pass through them thus decreasing the stress concentration in the material due to a reduced pile-up of dislocations, thus reducing its strength and increasing the resistant to crack growth. The CTB also plays an essential role in increasing the fatigue endurance, by allowing the dislocations to penetrate and slip through them [379][380][381], thus contributing to increased strength and ductility of the material.…”