Observation of Dynamic Deformation Behavior Around Interface of Bi-material Using DIC

Evaluation of dynamic fracture toughness of a bonded bi-material interface subject to high-strain-rate shearing using digital image correlation

“…Regarding materials with dissimilar interfaces, various studies have determined crack tip opening displacements [39,40], identified cracks [41], and determined mixed-mode stress intensity factors based on the displacement distributions near the crack tips [42] and indirect measurements of ultra-high-speed shear strain at the interfaces [43]. Studies investigating the interface of composites have combined the split Hopkinson pressure bar (SHPB) and mesh-DIC methods, where dynamic displacements and strain distributions in the composites were photographically measured using high-speed video cameras [44]. However, despite the investigations of all the aforementioned studies, we find that a method for directly determining the fracture toughness of the interface from the measurement result of DIC has not yet been proposed.…”