Abstract:Heat removing from a microelectronic chip packaging has grand effect on performance and durability of the chip. Today’s microchips with high power densities would require efficient methods of cooling. Recently, vertical alignment CNTs, due to their superior thermal, electrical and mechanical properties, was suggested as an effective micro cooler on the level of modern electronics demands. In this paper, the cooling performance of the CNT fin structures is studied numerically. Flow of air was considered as the … Show more
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