Numerical Simulations for Electromagnetic Power Module Design

Development of Physics-based Models and Design Optimization of Power Electronic Conversion Systems

“…The field vectors allow identifying critical chip placements and substrate layouts, where strong magnetic fields might induce unwanted voltages in the gate signal loops. Transient simulations using extracted impedance matrices and accurate IGBT and diode models show how these induced voltages affect the dynamic current sharing [7], [15], [40][41][42].…”

“…It consists of the low frequency model developed earlier [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16] with a lumped high frequency branch connected in parallel. The parameters required for modeling the low frequency model are calculated by nonlinear finite element solutions.…”

“…Clearance in inches=0.023"+(0.0002"×V) (3)(4)(5)(6)(7)(8)(9)(10)(11)(12)(13)(14)(15)(16)(17) where, V is the voltage peak across traces.…”

“…For calculating the width of external and internal traces, on PCB ANSI/IPC-2221/IPC-2221A design standards for calculation of trace width can be used which approximate the traces width as equations (3)(4)(5)(6)(7)(8)(9)(10)(11)(12)(13)(14)(15) and (3)(4)(5)(6)(7)(8)(9)(10)(11)(12)(13)(14)(15)(16).…”

“…The interaction of power electronic conversion system with other connected devices may raise many issues such as electromagnetic interference (EMI), overvoltage transients that threaten the lifetime of devices, current spikes and increased power loss [3][4][5][6][7][8][9][10][11].…”