Numerical simulation of MHD stirrer for 12 ton metallurgical aggregate

Bolotin, Kirill; Frizen, Vasiliy E.; Sokolov, Igor; Bychkov, Sergei A.

doi:10.1109/eiconrus.2018.8317166

Cited by 1 publication

(1 citation statement)

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“…In addition, the pump can operate at very high temperatures and demonstrate high efficiencies. They have been successfully used for a range of applications, including seawater thrusters for ship propulsion [18][19][20], liquid metal stirring and shaping for industrial applications [21][22][23], molten salt pumping in nuclear reactors cooling [24,25], blood pumping [26], sample propelling [27] etc.…”

Section: B Mhd Pump Cooling Applicationsmentioning

confidence: 99%

Thermal Management System for Press-Pack IGBT Based on Liquid Metal Coolant

Yerasimou

Pickert

Dai

et al. 2020

IEEE Trans. Compon., Packag. Manufact. Technol.

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The press-pack packaging technology has been adopted in recent years for insulated-gate bipolar transistors (IGBTs) to be utilized in high voltage -high current applications, such as high-voltage direct current (HVDC) electric power transmission. Traditionally, the heat management of such systems is based on water coolant, however, there are numerous challenges associated with that method, such as the requirement to deionize the water to prevent electrical potentials and inherent problems of corrosion and leakage in the cooling piping structure. This paper presents the design and development of a liquid metal heat sink for press-pack IGBTs. The use of a thermal management system based on liquid metal increases the heat dissipation capability without corroding the cooling structure. Analytical work is performed on the design of the heat sink. Moreover, the thermal performance of the heat sink is experimentally validated against a commercial water-based cooling system. The presented results show that the cooling performance of the liquid metal system is increased, whereas the shortcomings of the water-based system are eliminated. Index Terms-Press-pack insulated-gate bipolar transistor (IGBT) power module cooling, junction temperature, liquid metal cooling, magnetohydrodynamic (MHD) pump, high-voltage direct current (HVDC) cooling.

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