Numerical simulation of integrated liquid cooling and thermoelectric generation for self-cooling of electronic devices

Kiflemariam, Robel; Lin, Cheng-Xian

doi:10.1016/j.ijthermalsci.2015.02.012

Cited by 41 publications

(16 citation statements)

References 20 publications

(32 reference statements)

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“…According to the results from the study, thermal resistance between the heat source and the environment is reduced by 25 to 30% when the self-cooling concept is implemented. Robel et al have studied the relationship between coolant flow rate and heat flux at heat source device to study the viability of self-cooling concept [102]. They found out that at an optimum flow rate of cooling fluid, the required temperature of the heat source is possible to be kept while at the same time providing power.…”

Section: Progress On Teg Module Structural Improvementmentioning

confidence: 99%

A comprehensive review of thermoelectric technology: Materials, applications, modelling and performance improvement

Twaha

Zhu

Yan

et al. 2016

Renewable and Sustainable Energy Reviews

480

208

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Abstract:Thermoelectric (TE) technology is regarded as alternative and environmentally friendly technology for harvesting and recovering heat which is directly converted into electrical energy using thermoelectric generators (TEG). Conversely, Peltier coolers and heaters are utilized to convert electrical energy into heat energy for cooling and heating purposes The main challenge lying behind the TE technology is the low efficiency of these devices mainly due to low figure of merit (ZT) of the materials used in making them as well as improper setting of the TE systems. The objective of this work is to carry out a comprehensive review of TE technology encompassing the materials, applications, modelling techniques and performance improvement. The paper has covered a wide range of topics related to TE technology subject area including the output power conditioning techniques. The review reveals some important critical aspects regarding TE device application and performance improvement. It is observed that the intensified research into TE technology has led to an outstanding increase in ZT, rendering the use TE devices in diversified application a reality. Not only does the TE material research and TE device geometrical adjustment contributed to TE device performance improvement, but also the use of advanced TE mathematical models which have facilitated appropriate segmentation TE modules using different materials and design of integrated TE devices. TE devices are observed to have booming applications in cooling, heating, electric power generation as well as hybrid applications. With the generation of electric energy using TEG, not only does the waste heat provide heat source but also other energy sources like solar, geothermal, biomass, infra-red radiation have gained increased utilization in TE based systems.However, the main challenge remains in striking the balance between the conflicting parameters; ZT and power factor, when designing and optimizing advanced TE materials.Hence more research is necessary to overcome this and other challenge so that the performance TE device can be improved further.

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Section: Progress On Teg Module Structural Improvementmentioning

confidence: 99%

A comprehensive review of thermoelectric technology: Materials, applications, modelling and performance improvement

Twaha

Zhu

Yan

et al. 2016

Renewable and Sustainable Energy Reviews

480

208

View full text Add to dashboard Cite

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“…However, in combination with efficient power management strategies, 24 ultra-low power applications of this technology include the harvesting of waste heat for energy autonomous wireless remote sensor networks. 6 Additionally, the concept may be logically extended to higher power heat transfer applications including self-powered, compact cooling systems 7,8 for electronics comprising multiple power-dense devices, where collection of waste heat and effective energy recycling for thermal management has clear benefits.…”

Section: -6mentioning

confidence: 99%

“…7,8 Heat flux focusing is one manner in which heat flow may be controlled, [2][3][4][5]9,10 and different effects, such as heat flux cloaking or reversal, have also been demonstrated theoretically 9,11 and experimentally for thick devices, 10 planar structures, 12,13 and three-dimensional objects. 14 Recently, thermoelectric devices have also been applied to facilitate the manipulation of heat flow for an active thermal cloak around arbitrarily shaped regions.…”

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confidence: 99%

Collection of low-grade waste heat for enhanced energy harvesting

et al. 2016

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“…One step further, Kiflemariam confirmed that the thermal resistance of the heat sink acts as bottleneck [7], so he replaced it with a complete microfluidic dissipation system, composed of a microchannel heat sink, fluid conduits, a secondary heat sink and a pump [8]. For a 15 Â 15 mm 2 heat source, this author reported global thermal resistance of around 1.3 K/W, almost independent of source-to-ambient temperature difference.…”

Section: Introductionmentioning

confidence: 99%

Thermoelectric self-cooling for power electronics: Increasing the cooling power

Martínez

Astrain

Aranguren

2016

Energy

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a b s t r a c tThermoelectric self-cooling was firstly conceived to increase, without electricity consumption, the cooling power of passive cooling systems. This paper studies the combination of heat pipe exchangers and thermoelectric self-cooling, and demonstrates its applicability to the cooling of power electronics.Experimental tests indicate that source-to-ambient thermal resistance reduces by around 30% when thermoelectric self-cooling system is installed, compared to that of the heat pipe exchanger under natural convection. Neither additional electric power nor cooling fluids are required. This thermal resistance reaches 0.346 K/W for a heat flux of 24.1 kW/m 2 , being one order of magnitude lower than that obtained in previous designs. In addition, the system adapts to the cooling demand, reducing this thermal resistance for increasing heat.Simulation tests have indicated that simple system modifications allow relevant improvements in the cooling power. Replacement of a thermoelectric module with a thermal bridge leads to 33.54 kW/m 2 of top cooling power. Likewise, thermoelectric modules with shorter legs and higher number of pairs lead to a top cooling power of 44.17 kW/m 2 . These results demonstrate the applicability of thermoelectric self-cooling to power electronics.

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Numerical simulation of integrated liquid cooling and thermoelectric generation for self-cooling of electronic devices

Cited by 41 publications

References 20 publications

A comprehensive review of thermoelectric technology: Materials, applications, modelling and performance improvement

A comprehensive review of thermoelectric technology: Materials, applications, modelling and performance improvement

Collection of low-grade waste heat for enhanced energy harvesting

Thermoelectric self-cooling for power electronics: Increasing the cooling power

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