Numerical simulation of flow structures and temperature distribution in a Printed Circuit Board enclosure model at moderate Reynolds numbers

Varela, Sylvana; Usera, Gabriel; Vernet, Antón; Ferré, J. A.

doi:10.1016/j.ijthermalsci.2011.09.011

Cited by 6 publications

(5 citation statements)

References 12 publications

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“…The dynamic field shows that the flow structures present in the top channel are a pair of quasi-symmetric counter rotating vortices for both geometries. In the bottom channel the flow behaviour depends on the geometry, for the closed one it remains the pair of quasi-symmetric counter rotating vortices while in the open geometry these structures disappear giving way to smaller ones [14].…”

Section: Resultsmentioning

confidence: 99%

“…In order to determine the degree of mesh refinement needed to achieve a proper fit to resolve the momentum and temperature boundary layer, simulations were performed for different degrees of refinement. A refined grid with a spatial resolution set to h/65 near the walls and about h/40 at the core had been used in the simulations for all cases studied [14].…”

Section: Methodsmentioning

confidence: 99%

“…These convergence levels are adequate to analyse the state of flow strongly governed by the boundary conditions. All numerical model details can be found in [14]. In all cases the hot temperature was T h = 30ºC (plate temperature) while cold and reference temperature (fluid temperature) were T c = T ref = 20ºC.…”

Section: Methodsmentioning

confidence: 99%

See 2 more Smart Citations

Numerical simulation of heat transfer and temperature distribution in a printed circuit board enclosure model for different geometries and Reynolds numbers

Varela¹,

Usera²,

Vernet³

et al. 2014

Advances in Fluid Mechanics X

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The heat transfer analysis and temperature distribution inside printed circuit board (PCB) enclosures for different geometries was investigated in this paper. Herein, the computational fluid dynamic (CFD) solver caffa3d.MB was employed to simulate the 3D incompressible Navier-Stokes equations. The numerical method uses a spatial discretization based on block-structured, nonorthogonal body fitted grids. Numerical simulations for two different PCB geometry configurations are analysed using eight Reynolds numbers. The temperature field is practically the same above the plate encasing the PCB, differences appear below the plate. While analysing the plane just below for the open geometry the main consideration is the presence of a hot zone. The greater heat transfer is obtained in the top channel for both geometries. In turn, in the bottom channel the heat transfer is greater in the closed geometry than the open one. The calculating results show that the cooling of the PCB is more efficient for the closed geometry.

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Section: Resultsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

See 1 more Smart Citation

Numerical simulation of heat transfer and temperature distribution in a printed circuit board enclosure model for different geometries and Reynolds numbers

Varela¹,

Usera²,

Vernet³

et al. 2014

Advances in Fluid Mechanics X

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show abstract

“…The thermal response of electronic equipment has been widely investigated in previous studies through complex numerical simulations (e.g., [17,23,24]) and simplified physical models (e.g., [25−27]). According to Shapiro [28], there is the need for compact or reduced-order models, combined with experiments to identify the missing parts in the model, since small not-so-accurate models are more useful than large accurate models.…”

Section: Mathematical Modelmentioning

confidence: 99%

Cooling solutions for an electronic equipment box operating on UAV systems under transient conditions

Tanda

2020

International Journal of Thermal Sciences

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“…Heat removal from the electronic circuit component has become an important issue to take into account during design. Printed circuit boards (PCB) are electronic circuits that generate heat by Joule effect and need to be cooled down, usually done by air [2]. This is a problem of fluid flow in complex domain where we can find the coexistence of laminar and turbulent fluid regions and heat transfer effects by natural/forced convection, conduction and radiation.…”

Section: Introductionmentioning

confidence: 99%

Thermal Design and Thermal Analysis of an Enclosure in Harsh Environment Conditions

Yang

Pan³

et al. 2012

AMR

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The appropriate temperature is a critical factor for an enclosure with a stability guarantee. Therefore, in the prerequisite of vibration and Electro Magnetic Compatibility (EMC) being satisfied, how to make effective thermal design is what the research staff are generally concerned about. Firstly, a comprehensive description of the overall structure for a sealed enclosure is provided. Then the cooling plate is designed by using the method of theoretical calculation. At the same time, the temperature of the enclosure is analyzed by using Flow Simulation; the distribution of temperature field for the enclosure is obtained. Both classical heat transfer theory and a computational approach are used to verify the enclosure cooling performance. It turns out that applying the method of combining the theoretical calculation and simulation analysis cannot only improve the reliability of thermal analysis, but can also provide some valuable references to the research staff.

show abstract

Numerical simulation of flow structures and temperature distribution in a Printed Circuit Board enclosure model at moderate Reynolds numbers

Cited by 6 publications

References 12 publications

Numerical simulation of heat transfer and temperature distribution in a printed circuit board enclosure model for different geometries and Reynolds numbers

Numerical simulation of heat transfer and temperature distribution in a printed circuit board enclosure model for different geometries and Reynolds numbers

Cooling solutions for an electronic equipment box operating on UAV systems under transient conditions

Thermal Design and Thermal Analysis of an Enclosure in Harsh Environment Conditions

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