Numerical simulation for fin effect of a rectangular latent heat storage vessel packed with molten salt under heat release process

Inaba, Hideo; Matsuo, Kouichi; Horibe, Akihiko

doi:10.1007/s00231-002-0298-7

Cited by 16 publications

(3 citation statements)

References 2 publications

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“…20 Therefore, the addition of thermal conductivity enhancers (TCEs) inside the PCM-based heat sink (HS) has been widely studied in recent years. There are various thermal conductivity enhancement techniques such as inclusion of extended surface (metallic fins), [21][22][23][24][25] metallic foams, [26][27][28][29][30] and metallic nanoparticle [31][32][33][34] which may counterbalance the low thermal conductivity of organic PCM.…”

Section: Introductionmentioning

confidence: 99%

“…Among the several thermal conductivity enhancement techniques, the extended surface (metallic fins) is found to be most promising. [21][22][23][24][25] Several researchers carried out numerical and experimental investigation on PCM filled HS involving fins as TCEs. Studies have been made on PCM (RT-80) based HS involving internal plate fins with varying thickness.…”

Section: Introductionmentioning

confidence: 99%

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Numerical investigation of cross plate fin heat sink integrated with phase change material for cooling application of portable electronic devices

et al. 2021

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The design of thermal management system needs to be made in such a way that can avoid the possible overheating and failure of electronic components because of higher power density. Thermal performance of heat sink (HS) configurations involving different number of cavities (1, 4, 9, 16, 25, and 36), formed by cross plate fins arrangement, as applicable to thermal management of electronic components, are studied numerically by employing pressure-based finite volume method. Mass and thermal capacity of each HS configuration are kept constant and various heat flux values (1.0, 1.5, and 2.0 kW/m 2 ) are used in the analysis.The performance of various HS configurations is evaluated based on the transient temperature variation of HS base, PCM melt fraction, average Nusselt number, and energy absorbed by PCM through both latent and sensible heat. The study also investigates the effect of various PCM materials on thermal performance of HS. Maximum 10 C of temperature reduction is achieved in case of HS with 25 cavities compared to HS with a single cavity. For HS with 36 cavities, the melting time of the PCM reduces by 46.5% with the increase in the heat flux values from 1.0 to 2.0 kW/m 2 . The study on effect of PCM type reveals that paraffin wax is ideally suited for those electronic devices which have the critical set point temperature (SPT) above 60 C and below 70 C.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Numerical investigation of cross plate fin heat sink integrated with phase change material for cooling application of portable electronic devices

et al. 2021

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“…Inaba et al [25] presents a numerical study of solidification in a system in which rectangular tubes are arranged vertically in a heat storage vessel filled with a molten PCM, and plate fins are installed horizontally between those tubes. Their numerical results elucidate the flow pattern, velocity profile and heat transfer rate in the melted liquid layer, revealing that the amount of transported heat through the fins increased with the fin thickness, and the heat release completion time period was shortened.…”

Section: Introductionmentioning

confidence: 99%