2010
DOI: 10.1016/j.ijmachtools.2010.02.003
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Numerical simulation and experimentation of a novel micro scale laser high speed punching

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Cited by 59 publications
(19 citation statements)
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“…The plasma continues to absorb the laser energy. The rapidly expanding plasma is confined by the transparent confinement layer, and creates a high surface pressure, which propagates into the hump as a shockwave [20,21]. The shockwave drives the hump to impact onto the base plate at a high speed.…”
Section: Mechanism Of Laser Impact Spot Weldingmentioning
confidence: 99%
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“…The plasma continues to absorb the laser energy. The rapidly expanding plasma is confined by the transparent confinement layer, and creates a high surface pressure, which propagates into the hump as a shockwave [20,21]. The shockwave drives the hump to impact onto the base plate at a high speed.…”
Section: Mechanism Of Laser Impact Spot Weldingmentioning
confidence: 99%
“…The result showed that apparent element diffusion did not occur across the weld interface. In the LISW process, laser induced shockwave pressure can reach several GPa, but the peak pressure is only maintained for a few nanoseconds [21]. Accordingly, element diffusion occurs with difficulty in the LISW of Ti and Cu.…”
Section: Microstructurementioning
confidence: 99%
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“…Elastic waves propagate from soft punch to workpiece, namely from low impedance medium (ρ0C0)2 into the high impedance medium (ρ0C0)1, so σ3 > σ1 according to Equation (8), which means the intensity of transmitted waves is larger than that of incident waves:…”
Section: Soft Punch Hardnessmentioning
confidence: 99%
“…However, there exist difficulties in manufacturing punching tools economically as well as complex alignment problems between micro punch and die in these researches, thus, Rhim et al [7] used silicone rubber instead of the rigid punch as a pressure transmission medium, and punched array of micro-holes on copper and titanium foil successfully with the single crystal silicon die. Liu et al [8] combined laser shock technique with punching process, and developed a new type of micro-forming technology, so that the 250 µm micro-hole was punched successfully on the copper foil of thickness between 10 and 30 µm. This technique used the intense laser beam as the micro punch rather than a traditional punch in order to solve the difficulty of complex punch-to-die alignment and punch fabrication in the process of micro punching to a great extent.…”
Section: Introductionmentioning
confidence: 99%