2019
DOI: 10.1007/s10973-019-08899-x
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Numerical simulation and experimental investigation of air cooling system using thermoelectric cooling system

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Cited by 21 publications
(4 citation statements)
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“…This devive offer many advantages such as small in size, portable, noiseless, environmentally friendly and economical compared to conventional cooling systems. They have been utilized in various applications for example air-conditioning [18], [19], electronic device cooling [20], batteries cooling [21]- [23] and medical science [24]- [26]. Moreover, it has been reported that the thermoelectric cooling system can be used to improve the cooling performance of an evaporative air-cooling systems [13], [27], [28].…”
Section: Issn: 2502-4752 mentioning
confidence: 99%
“…This devive offer many advantages such as small in size, portable, noiseless, environmentally friendly and economical compared to conventional cooling systems. They have been utilized in various applications for example air-conditioning [18], [19], electronic device cooling [20], batteries cooling [21]- [23] and medical science [24]- [26]. Moreover, it has been reported that the thermoelectric cooling system can be used to improve the cooling performance of an evaporative air-cooling systems [13], [27], [28].…”
Section: Issn: 2502-4752 mentioning
confidence: 99%
“…Additionally, it requires no maintenance and is noiseless [30,[39][40][41]. The modularity, miniaturization [41][42][43][44], and efficiency of TEC devices fit well with the development of chips, which has a good prospect of application in the field of heat dissipation and temperature control of chips [45,46]. Some researchers have carried out corresponding research in this area.…”
Section: Introductionmentioning
confidence: 99%
“…Some researchers have carried out corresponding research in this area. Moazzez et al used ANSYS CFX software to simulate the air−cooling capacity of thermoelectric cooling devices under different conditions to develop the vehicle air conditioning refrigeration system [45]. Chen et al systematically summarized the research progress of the most advanced on−chip thermoelectric cooling devices, and pointed out the development prospects of the design, performance, and application of these cooling devices [44].…”
Section: Introductionmentioning
confidence: 99%
“…In addition, the modularity [41,42], miniaturization [43,44] and efficiency of TEC devices have a good fit with the development of chips, which has a good prospect of application in the field of heat dissipation [45] and temperature control of chips [46]. Moazzez et al used ANSYS CFX software to simulate the air cooling capacity of thermoelectric cooling devices under different conditions to develop the vehicle air conditioning refrigeration system [47]. Chen et al systematically summarized the research progress of the most advanced on-chip thermoelectric cooling devices, and pointed out the development prospects of the design, performance and application of onchip thermoelectric cooling devices [46].…”
Section: Introductionmentioning
confidence: 99%