2002
DOI: 10.1016/s0017-9310(02)00006-6
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Numerical optimization of the thermal performance of a microchannel heat sink

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Cited by 164 publications
(60 citation statements)
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“…In addition, for the flow with higher Reynolds numbers, the singular point is closer to the exit of the channel. Ryu et al (12) studied the thermo-fluidic behavior of heat sink for microchannel using conventional simulation means and their results are within 4% of those presented by Tuckerman and Pease (2) . Furthermore, when the depth to width ratio is less than 10, an optimum heat dissipation effect is achievable for the heat sink using microchannel.…”
Section: Introductionsupporting
confidence: 58%
“…In addition, for the flow with higher Reynolds numbers, the singular point is closer to the exit of the channel. Ryu et al (12) studied the thermo-fluidic behavior of heat sink for microchannel using conventional simulation means and their results are within 4% of those presented by Tuckerman and Pease (2) . Furthermore, when the depth to width ratio is less than 10, an optimum heat dissipation effect is achievable for the heat sink using microchannel.…”
Section: Introductionsupporting
confidence: 58%
“…When the volume constraint was applied, the optimal micro pin-fin aspect ratio for four, five and seven rows of micro pin fins had a constant value of 0.555, 0.621 and 0.735 respectively for the whole range of Bejan numbers used in this study. The pin-fin aspect ratio for the integrated design with three rows was 0.480, which did not meet the manufacturing constraint as stated in Equation (6). As a result of this, numerical simulation results for this were not reported for the variable axial length.…”
Section: Integrated Design(id) With Variable Axial Lengthmentioning
confidence: 94%
“…The pin-fin aspect ratio for two rows of micro pin fins was 0.434, which did not meet the manufacturing constraint in Equation (6). Therefore, numerical simulations for this were not reported.…”
Section: Integrated Design (Id) With Fixed Lengthmentioning
confidence: 99%
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“…This microchannel cooling concept explains that the convective heat transfer coefficient is inversely proportional with the channel width. From this concept [2], it was found that the use of high-aspect ratio to a certain level will further reduce thermal resistances and this concept has proven to be instrumental in cooling electronic devices due to inherent simplicity, reliability, low cost and has been extensively been used in recent years [2][3][4][5][6][7].…”
Section: Introductionmentioning
confidence: 99%