Numerical Optimization of a CPU Heat Sink Geometry

Abstract

During its operation CPU dissipates undesirable heat. Therefore, heat sink is very essential in modern computing system to absorb extra heat dissipated by the CPU. Forced convection air cooling is common approach. In the present work, a steady-state convective heat transfer process is analyzed for CPU cooling. A rectangular fin heat sink equipped in a computer chassis is numerically investigated and simulated using the software ANSYS CFX. A two-equation based turbulence model is chosen to capture the turbulence of the flow inside the domain. The overall dimension of the heat sink is optimized for three different parameters of the heat sink such as fin quantity, fin height and baseplate thickness. An optimum fin quantity, fin height and baseplate thickness are found, and, respectively. Two different orientations of fins are also compared. Better thermal performance is achieved when the fin channel is perpendicular to the surface parallel to the outlet. The average temperature of the heat sink is found. It is also predicted that the heat sink studied here is capable to keep the CPU temperature underthat is reasonably acceptable.

Thermal Management of Microelectronic Devices Using Nanofluid with Metal foam Heat Sink

“…Nanoparticles enhance the thermal properties of the base fluid, thereby increasing heat dissipation. Failing to achieve the required heat dissipation affects the performance and ultimately results in the malfunctioning of the device [ 1 ]. Elnaggar [ 2 ] carried out an analytical investigation and monitored the effect of the number of fins and the fin thickness on the performance of the heat sink.…”