Numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system

Illés, Béla; Skwarek, Agata; Géczy, Attila; Krammer, Olivér; Busek, David

doi:10.1016/j.ijheatmasstransfer.2017.06.091

Cited by 27 publications

(18 citation statements)

References 26 publications

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“…We proved in our previous studies by numerical simulations (Illés et al , 2017a, 2017b) that the pressure reduction process modifies the ordinary heat transfer mechanism of the VPS system, which might have negative effects on the formation of solder joint. It was found that when the vapour is being suctioned out from the soldering chamber, high spatial flow velocity difference forms and causes considerable vapour concentration gradients.…”

Section: Introductionmentioning

confidence: 76%

“…The numerical conversion of the model was performed using finite difference method and was solved using explicit forward time central space algorithm (Illés et al , 2017a). The numerical model was built and solved in MATLAB software.…”

Section: Methodsmentioning

confidence: 99%

“…The most widely used heat transfer fluid is the “Galden”, which is composed of ether chains closed with carbon-fluorine bonds (perfluoropolyether). The boiling point of the Galden liquid can be set with the length of the ether chain and is approximately150-270°C (Illés et al , 2017a, 2017b, 2017c).…”

Section: Introductionmentioning

confidence: 99%

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Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system

Illés

Skwarek

Géczy

et al. 2018

SSMT

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Purpose The vacuum vapour phase soldering method was investigated by numerical simulations. The purpose of this study was to examine the temperature changes of the solder joints during the vapour suctioning process. A low pressure is used to enhance the outgassing of the trapped gas within the solder joints, which otherwise could form voids. However, the system loses heat near the suction pipe during the suctioning process, and it can result in preliminary solidification of the solder joints before the gas could escape. Design/methodology/approach A three-dimensional numerical flow model based on the Reynolds averaged Navier–Stokes equations with the standard k-e turbulence method was developed. The effect of the vapour suctioning on the convective heat transfer mechanism was described by the model. Temperature change of the solder joints was studied at the mostly used substrate and component combinations, as well as at different system settings. Findings In the function of the substrate thickness and the component size, the solder joints can lose large amount of heat during the void reduction process, which leads to preliminary solidification before the entrapped gas voids could be removed. Research limitations/implications The results provide setting information of vacuum vapour phase technology for appropriate and optimal applications. Originality/value The relationship between low pressure generation and convective heat transfer mechanism during vacuum vapour phase soldering has not been studied yet. The possible negative effects of the vapour suctioning process on the solder joint temperature are unknown.

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Section: Introductionmentioning

confidence: 76%

Section: Methodsmentioning

confidence: 99%

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Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system

Illés

Skwarek

Géczy

et al. 2018

SSMT

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“…The basics of saturated vapour generation, condensation and film layer formation were investigated through detailed multi-physics modelling. Also, simpler models were applied to describe the heating of PCBs as 2D objects [1][2]. Continuing this line of research, we introduce 3D thermal modelling on component level during VPS.…”

Section: Introductionmentioning

confidence: 99%

“…Vapour phase soldering (VPS) is a reflow soldering method used in electronics manufacturing. It is an alternative to the widely used forced convection and nowadays less significant infrared heating processes [1][2][3]. During reflow soldering, solder paste is printed onto the pads of the printed circuit board (PCB), and then the electrical components are positioned and placed onto the deposits of the solder.…”

Section: Introductionmentioning

confidence: 99%

Component level modelling of heat transfer during vapour phase soldering with finite difference ADI approach

Bozsóki

Géczy

Illés

2019

International Journal of Heat and Mass Transfer

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In this paper the complex heat transfer process of the vapour phase soldering has been investigated on the level of electronic components. VPS is gaining increased attention lately, and the process needs different approach of modelling, compared to conventional soldering processes in electronics mass manufacturing. Component level modelling was not studied deeply in the literature before, so our focus pointed to heat transfer on large size surface mounted electronic components. Applying the Fourier type heat conduction equation, a detailed 3D thermal model of a polyester capacitor on a printed circuit board was implemented based on x-ray images of an actual assembly. Our model incorporates inner geometry, material inhomogeneity, composite materials and anisotropic thermal conductivity as important thermal features. Transient heating was calculated with Finite Difference Method combining an alternating direction implicit (ADI) approach, using averaged heat transfer coefficient. Validation measurements were taken in our VPS system. The measured data show good agreement with the calculation results and points to possible application for use in advanced engineering environment.

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Vapor-phase reflow soldering ovens

2020

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Numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system

Cited by 27 publications

References 26 publications

Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system

Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system

Component level modelling of heat transfer during vapour phase soldering with finite difference ADI approach

Vapor-phase reflow soldering ovens

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