Numerical modeling of the thermoelectric cooler with a complementary equation for heat circulation in air gaps

Abstract

Abstract:In this paper, a numerical model is developed by combining thermodynamics with heat transfer theory. Taking inner and external multi-irreversibility into account, it is with a complementary equation for heat circulation in air gaps of a steady cooling system with commercial thermoelectric modules operating in refrigeration mode. With two modes concerned, the equation presents the heat flowing through air gaps which forms heat circulations between both sides of thermoelectric coolers (TECs). In numerical modelling, a TEC is separated as two temperature controlled constant heat flux reservoirs in a thermal resistance network. In order to obtain the parameter values, an experimental apparatus with a commercial thermoelectric cooler was built to characterize the performance of a TEC with heat source and sink assembly. At constant power dissipation, steady temperatures of heat source and both sides of the thermoelectric cooler were compared with those in a standard numerical model. The method displayed that the relationship between f and the ratio ′ c / c was linear as expected. Then, for verifying the accuracy of proposed numerical model, the data in another system were recorded. It is evident that the experimental results are in good agreement with simulation(proposed model) data at different heat transfer rates. The error is small and mainly results from the instabilities of thermal resistances with temperature change and heat flux, heat loss of the device vertical surfaces and measurements.

Designing a single­cascade thermoelectric cooler with the predefined time to enter a stationary mode of operation

“…Authors of [7] presented a numerical simulation of the thermoelectric cooler taking into consideration the circulation of heat in the air gaps between the thermoelements, which affect their temperature gradients. Work [8] considers the impulse operation of thermoelectric coolers, which leads to an increase in average cooling capacity, but the pulse mode exacerbates the problem of temperature gradients.…”

Investigation on the impacts of thickness on thermal stress on Thermoelectric materials MoSi2 and Mo5SiB2

“…Though, the means of transportation of charge carriers in such intricate resources is entirely unstated [5], capabilities of such nano structured materials are not easy in synthesis in addition to fall short in meeting industrial wishes. Currently, researchers have focused in optimizing the performance of device, like Thomson-effect [6,7], contact resistance [8][9][10], heat exchanger [11,12], leg numbers [13] and geometry [14,15]. Those most favorable design techniques [16][17][18][19] have technically grown with full-fledge.…”

Analysis of Dynamic and Reliability Indicators of Athermoelectric Cooler at Minimization of a Complex Ofthree Basic Parameters

“…From the point of view of the theory of reliability, the heat-loaded element and the heat removal system are connected in series; the resulting probability of failure-free operation is equal to the product of the indicators of the components [4]. If we take into account the requirements for the weight and size parameters of onboard systems, then there is practically no alternative to thermoelectric coolers at present [5][6]. The coordination of the energy relationship of the heat-loaded element with the heat extraction system is considered in [7], where, on the basis of the thermodynamic balance, interaction surfaces and thermophysical parameters of materials are taken into account [8].…”