Numerical modeling of the electroplating process for microvia fabrication

Strusevich, N.; Bailey, C.; Costello, Suzanne; Patel, Mayur; Desmulliez, Marc Phillipe Yves

doi:10.1109/eurosime.2013.6529989

Cited by 3 publications

(3 citation statements)

References 5 publications

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“…The EITM under the conditions of basic ED has been validated against real-life experiments and known benchmarks [1]. The obtained numerical results demonstrate that basic ED does not guarantee a good quality filling of micro features, even for relatively low AR such as 1:1.…”

Section: Numerical Modeling Of Basic Edmentioning

confidence: 91%

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Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming

et al. 2013

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This paper considers the copper electrodeposition processes in microvias and investigates whether the quality of the electroplating process can be improved by acoustic streaming using megasonic transducers placed into a plating cell. The theoretical results show that acoustic streaming does not take place within the micro-via (either through or blind-via's) but it does help improve cupric ion transport in the area close to the mouth of a via. This replenishment of cupric ions at the mouth of micro-via leads to better quality filling of the micro-via through diffusion compared to basic conditions. Experiments showing the improved quality of the filling of vias are also presented.

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Section: Numerical Modeling Of Basic Edmentioning

confidence: 91%

“…See Under basic ED conditions, it is assumed that the electrolyte is a still solution with no additives. As shown by numerical and real-life experiments [1], basic ED does not guarantee via fillings of an acceptable quality. This is usually attributed to insufficient ion transport into the via over time.…”

Section: Introductionmentioning

confidence: 99%

Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming

et al. 2013

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“…One such approach is to use the Arbitrary Lagrangian-Eulerian (ALE) [10] or a dynamic mesh method [2] that moves the mesh based on the motion of a boundary. Other approaches include a level set method [7][8][9], an explicit interface tracking method (EITM) [12,13], and the finite area method (FAM) [1]. Here the FAM is used because the growth of the copper layer is small in comparison to the domain size, and, therefore, would have negligible effects on the motion of the fluid.…”

Section: Introductionmentioning

confidence: 99%

Multi-Physics Modeling of Electrochemical Deposition

Kauffman

Gilbert

Paterson

2020

Fluids

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Electrochemical deposition (ECD) is a common method used in the field of microelectronics to grow metallic coatings on an electrode. The deposition process occurs in an electrolyte bath where dissolved ions of the depositing material are suspended in an acid while an electric current is applied to the electrodes. The proposed computational model uses the finite volume method and the finite area method to predict copper growth on the plating surface without the use of a level set method or deforming mesh because the amount of copper layer growth is not expected to impact the fluid motion. The finite area method enables the solver to track the growth of the copper layer and uses the current density as a forcing function for an electric potential field on the plating surface. The current density at the electrolyte-plating surface interface is converged within each PISO (Pressure Implicit with Splitting Operator) loop iteration and incorporates the variance of the electrical resistance that occurs via the growth of the copper layer. This paper demonstrates the application of the finite area method for an ECD problem and additionally incorporates coupling between fluid mechanics, ionic diffusion, and electrochemistry.

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