Numerical investigation on the effect of condensate layer formation around large-size components during vapour phase soldering

Illés, Béla; Géczy, Attila; Krammer, Olivér; Dusek, Karel; Busek, David

doi:10.1016/j.ijheatmasstransfer.2018.04.079

Cited by 9 publications

(2 citation statements)

References 23 publications

(29 reference statements)

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“…The author proved that the keepout zones are even more important in the case of large sized components since they can cause congestion of the condensate layer which results in considerable condensate thickness differences between the opposite leads (and solder joints) of the component together with considerable heat transfer differences. This can cause difference in the onset of solder alloy melting between the opposite leads even 2s (Illés et al, 2018A).…”

Section: Numerical Simulation Of the Vps Processmentioning

confidence: 99%

“…Therefore, with a moderate inclination of the assembly might reduce the soldering failures during the VPS process It was proven, that the keepout zones are even more important in the case of large sized components since they can cause congestion of the condensate layer which results in considerable condensate thickness differences between the opposite leads (and solder joints) of the component together with considerable heat transfer differences. This can cause difference in the onset of solder alloy melting between the opposite leads even 2s (Illés et al, 2018A). According to the industrial experiments if the difference in onset of melting is over 0.2-0.3s, then the probability of component displacement failure increases considerably.…”

Section: Temperature [°C]mentioning

confidence: 99%

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Vapour phase soldering (VPS) technology: a review

Illés

Géczy

Medgyes

et al. 2019

SSMT

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Purpose: This paper presents a review of the recent developments about the vapour phase soldering technology. This study focuses on the fallowing topics: recent developments of the technology (like soft and vacuum vapour phase soldering); measurement and characterization methods of vapour space (temperature and pressure); numerical simulation of the VPS soldering process (like condensate layer and solder joint formation); and quality and reliability studies of the solder joints prepared by VPS (like void content and microstructure of the solder joints). Design/methodology/approach: This study was written according to the results of a worldwide literature review about the substantial previous works in the past decade and according to the own results and experiences of authors from around the globe. Findings: Up to now, a part of the electronics industry believes that the reflow soldering with VPS method is a significant alternative of convection and infrared technologies. The summarized results of the field in this study supports this idea. Research limitations/implications: This literature review provides engineers and researchers with understanding the limitations and application possibilities of the VPS technology and the current challenges in soldering technology. Originality/value: Our paper summarizes the most important advantages of VPS technology compared to the other reflow soldering methods as well as points out the necessary further developments and possible research directions

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Section: Numerical Simulation Of the Vps Processmentioning

confidence: 99%

Section: Temperature [°C]mentioning

confidence: 99%