Purpose: This paper presents a review of the recent developments about the vapour phase soldering technology. This study focuses on the fallowing topics: recent developments of the technology (like soft and vacuum vapour phase soldering); measurement and characterization methods of vapour space (temperature and pressure); numerical simulation of the VPS soldering process (like condensate layer and solder joint formation); and quality and reliability studies of the solder joints prepared by VPS (like void content and microstructure of the solder joints). Design/methodology/approach: This study was written according to the results of a worldwide literature review about the substantial previous works in the past decade and according to the own results and experiences of authors from around the globe. Findings: Up to now, a part of the electronics industry believes that the reflow soldering with VPS method is a significant alternative of convection and infrared technologies. The summarized results of the field in this study supports this idea. Research limitations/implications: This literature review provides engineers and researchers with understanding the limitations and application possibilities of the VPS technology and the current challenges in soldering technology. Originality/value: Our paper summarizes the most important advantages of VPS technology compared to the other reflow soldering methods as well as points out the necessary further developments and possible research directions