2023
DOI: 10.1016/j.enconman.2022.116481
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Numerical feasibility study of using ultrasonic surface vibration as a new technique for thermal management of the electronic devices

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Cited by 7 publications
(1 citation statement)
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“…Cooling system design for thermal management and safety operating of heat transfer (HT) devices become an important topic. Especially, in the field of electronics, huge amount of heat is dissipated within a limited volume which should be removed as fast and as efficiently as possible for safety operation requirements (Shahsavar et al , 2023; Mozafari et al , 2021). In batteries, operation at higher temperatures is a risk for the failure of the system and fires/explosion in the workplace (Can et al , 2022).…”
Section: Introductionmentioning
confidence: 99%
“…Cooling system design for thermal management and safety operating of heat transfer (HT) devices become an important topic. Especially, in the field of electronics, huge amount of heat is dissipated within a limited volume which should be removed as fast and as efficiently as possible for safety operation requirements (Shahsavar et al , 2023; Mozafari et al , 2021). In batteries, operation at higher temperatures is a risk for the failure of the system and fires/explosion in the workplace (Can et al , 2022).…”
Section: Introductionmentioning
confidence: 99%