Numerical and Test Evaluation on Adhesion Properties in Cr/Al Interface Film Structure

Abstract

The aim of this article is to provide a systematic method to perform experimental test and theoretical evaluation on adhesion properties of the Cr/Al interface structure. A specified Cr/Al interface film assembly was deposited on the quartz glass by using RF magnetron sputtering. The elastic modulus and the hardness of the sample are tested by the nanoindentation tester. The test results show that the elastic modulus and the hardness of the sample have a nonlinear characteristic with different depth h of the interface structure. In the meantime, a finite element model is built to simulate the interface characteristics of the sample. The analysis shows that the stress mainly centralizes close to the top of the nanoindentation tester and the maximum stress occurs in the second layer Al film, not the first layer Cr film. The comparison between the test and the simulation shows the validity of the experimental test and the modeling method of each other. It builds a basis for future work such as fabrication of Cr/Al interface structure for micro/nano manufacturing.

Numerical simulation of thermal properties at Cu/Al interfaces based on hybrid model

“…The ISE method has a good performance in discontinuous medium mechanics (Zhuo et al, 1995) and is introduced in the MD-FE model (Yang et al, 2009(Yang et al, , 2011Yang and Liao, 2008) to couple different scale methods. The coupling regions among different methods are defined as handshake regions.…”

“…Interface structures between dissimilar materials are usually under high stress gradients due to the presence of interfacial thermal mismatches ( Ju et al, 2010;Zhang et al, 2012;Grujicic et al, 2005;Yang et al, 2011). Multiscale modeling methods are widely used to analyze interfacial properties for micro/nano structures ( Ju et al, 2010;Zhang et al, 2012Zhang et al, , 2013Grujicic et al, 2005;Yang et al, 2009Yang et al, , 2011Yang et al, , 2014Curtin and Miller, 2003;Jean et al, 2011;Shan and Nackenhorst, 2010;Bobaru and Ha, 2011;Wang et al, 2008;Chen et al, 2009;Liao, 2007, 2008;Clancy et al, 2010;Ivanov and Zhigilei, 2003;Zhuo et al, 1995;Yu et al, 2011;Johnson, 1989;Lukes et al, 2000;Huang et al, 2009;Xu and Buehler, 2009;Choi and Maruyama, 2005;Hegedus and Abramson, 2006;Stevens et al, 2007). Hybrid models based on molecular dynamics (MD) and finite element (FE) were built to investigate the thermal resistance and nanocracks (Curtin and Miller, 2003;Jean et al, 2011;Shan and Nackenhorst, 2010;Bobaru and Ha, 2011).…”