2022
DOI: 10.1016/j.jcrysgro.2022.126608
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Numerical and experimental investigation on mc-Silicon growth process by varying the Si3N4 coating thickness of crucible

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Cited by 3 publications
(2 citation statements)
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“…The segregation coe cients of O and C in silicon are 1.25 [27] and 0.07 [28], respectively. The O and C transport in a DS furnace is shown in Table 1, which is mainly divided into ve parts: (1) At high temperature, the O dissolves from the quartz crucible wall and comes into the silicon melt; (2) The dissolved O atoms are transported to the free surface by the melt ow, react with silicon atoms to form silicon monoxide (SiO) gas and evaporate from the free surface; (3) The SiO carried away by the argon to the graphite parts and reacts with them to form C monoxide (CO) gas; (4) CO is transferred back to the free surface of melt by argon ow in the furnace, and then dissolves into the silicon melt in the form of O and C atoms; (5) The O and C atoms in the melt are segregated into the crystal.…”
Section: Coupled Model Of Oxygen and Carbon Transportmentioning
confidence: 99%
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“…The segregation coe cients of O and C in silicon are 1.25 [27] and 0.07 [28], respectively. The O and C transport in a DS furnace is shown in Table 1, which is mainly divided into ve parts: (1) At high temperature, the O dissolves from the quartz crucible wall and comes into the silicon melt; (2) The dissolved O atoms are transported to the free surface by the melt ow, react with silicon atoms to form silicon monoxide (SiO) gas and evaporate from the free surface; (3) The SiO carried away by the argon to the graphite parts and reacts with them to form C monoxide (CO) gas; (4) CO is transferred back to the free surface of melt by argon ow in the furnace, and then dissolves into the silicon melt in the form of O and C atoms; (5) The O and C atoms in the melt are segregated into the crystal.…”
Section: Coupled Model Of Oxygen and Carbon Transportmentioning
confidence: 99%
“…However, the oxygen(O) and carbon(C) impurities are the main harmful impurities in the DS process [3]. The O and C impurities signi cantly in uence the electrical properties and mechanical strength of silicon wafers [4][5][6]. When the content of the C impurity exceeds its solubility limit in silicon, it will precipitate to form silicon carbide (SiC) particles and cause signi cant deterioration of the conversion e ciency of solar cells [7].…”
Section: Introductionmentioning
confidence: 99%