2021 14th International Congress Molded Interconnect Devices (MID) 2021
DOI: 10.1109/mid50463.2021.9361623
|View full text |Cite
|
Sign up to set email alerts
|

Numerical and experimental analysis of high pressure forming and injection molding processes with assembled film electronics

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1

Citation Types

0
4
0

Year Published

2023
2023
2023
2023

Publication Types

Select...
1

Relationship

0
1

Authors

Journals

citations
Cited by 1 publication
(4 citation statements)
references
References 0 publications
0
4
0
Order By: Relevance
“…The pressure gradients' contribution to the overall component's tangential force F t is considerable. An examination of the shear stresses alone (as done in [10]) would therefore result in a significant underestimation of the prevailing component's tangential forces (F t=n = F t ∼ = 2•F t * ).…”
Section: Discussionmentioning
confidence: 99%
See 3 more Smart Citations
“…The pressure gradients' contribution to the overall component's tangential force F t is considerable. An examination of the shear stresses alone (as done in [10]) would therefore result in a significant underestimation of the prevailing component's tangential forces (F t=n = F t ∼ = 2•F t * ).…”
Section: Discussionmentioning
confidence: 99%
“…γ) and viscosities (η), and hence the shear forces F s = . γ•η•A 0805 at any time during the cycle [11]. Their simulation showed shear forces F s = 0.8 .…”
Section: Introductionmentioning
confidence: 95%
See 2 more Smart Citations