Numerical analysis on the influent factors of the interface stress of 63Sn37Pb under the temperature cycle condition

Li, Zhi; Jin, Hai-Jun; Wu, Qiong; Dai, Hui-tao; Zhao, Mei-rong

doi:10.1109/icrms.2009.5270041

Cited by 1 publication

(1 citation statement)

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“…QFP electronic devices mock-up shown in Figure 1, the temperature cycle of the calculation model of QFP solder joints shown in Figure 2, Sn3.5Ag0.75Cu lead-free solder meshing is shown in Figure 3. Because of lead-free solder Sn3.5Ag0.75Cu visco-plastic, the solder unit type choose to VISCO108 (can be used to solve the presence of large plastic strain and nonlinear behavior) [4][5][6], other materials unit type selection PLANE82 (can be used to describe the plastic strain and large strain of the capacity). The model is applied to the whole bottom of the boundary constraints (Figure 2).…”

Section: Numerical Model and Materials Propertymentioning

confidence: 99%

Analysis of Interface Stress of Sn3.5Ag0.75Cu Solder under Temperature Cycle QFP Device

Zhang

Zhao

et al. 2011

AMM

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Using elastoplastic finite element method study the interface stress distribution of Sn3.5Ag0.75Cu lead-free solder at different temperatures and different strain rate. Numerical analysis results show that: when strain-rate is identical, as the temperature rises, the interface stress increased rapidly of Sn3.5Ag0.75Cu lead-free solder and the substrate binding sites, from 11 °C when 2.6MPa rose to 90 °C in 49.7MPa, so the temperature is very large have effects of the interface stress of the lead-free solder and the substrate binding sites; when the temperature is constant, as the strain rate increases, Sn3.5Ag0.75Cu lead-free solder and the substrate binding sites of the interface stress showed a slight increase, from 0.005% / S when the 49.47MPa rose to 0.005% / S when the 50.08MPa, so strain rate on lead-free solder and the substrate binding sites of the interface stress effect is very small, indicating Sn3 .5Ag0.75Cu lead-free solder has strong rate-independent nature.

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Section: Numerical Model and Materials Propertymentioning

confidence: 99%