2020
DOI: 10.1007/s00231-020-02911-z
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Numerical analysis of solidification of PCM in a closed vertical cylinder for thermal energy storage applications

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Cited by 13 publications
(5 citation statements)
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“…According to their results, adding 1 wt% of graphene and 4 wt% of fumed silica enhanced the thermal conductivity of the PCM composite by 55.4% and helped to eliminate the PCM leakage problem. Izgi et al [ 25 ] studied the solidification process of a PCM inside a three-dimensional cylinder. They focused on finding controlling parameters for this phenomenon.…”
Section: Introductionmentioning
confidence: 99%
“…According to their results, adding 1 wt% of graphene and 4 wt% of fumed silica enhanced the thermal conductivity of the PCM composite by 55.4% and helped to eliminate the PCM leakage problem. Izgi et al [ 25 ] studied the solidification process of a PCM inside a three-dimensional cylinder. They focused on finding controlling parameters for this phenomenon.…”
Section: Introductionmentioning
confidence: 99%
“…CFD methods have also been used to improve the performance of macroencapsulation PCM. Izgi and Arslan 265 suggested that the solidification time of the PCM could be reduced by 50% for a vertical capsule with a smaller diameter of 15 mm compared with 25 mm. Soodmand et al 266 assessed the melting and solidification properties of a PCM encapsulated in triangular, rectangular, and cylindrical closures in vertical or horizontal orientations.…”
Section: Thermal Enhancementmentioning
confidence: 99%
“…After t = 5 h, with the copper foam, the entire volume of the PCM was in the melting range; on the contrary, with the pure PCM, only 59.4% of the case volume was in that range. From t = 9 h to t = 13 h, the copper-foam-loaded PCM was completely involved in the melting process and after t = 13 h about 7.8% of the PCM volume was already in a super-heated liquid state (a liquid state with a temperature higher than the melting one [57]). On the contrary, in the presence of pure PCM, the more time that passes, the higher the thermal difference between the top and bottom layers becomes: after t = 9 h, the solid phase was still present on the case bottom; after t = 13 h, there was no more solid PCM, but the thermal distribution indicates how the PCM layers close to the heater were in a liquid state, while the bottom layers were still involved in the melting process.…”
Section: Comparison Between Pure Pcm and Copper-foam-loaded Pcmmentioning
confidence: 99%