Numerical analysis of fine lead bonding-effect of pad thickness on interfacial deformation

Takahashi, Yasuo; Inoue, Miyako; Inoue, Kohei

doi:10.1109/6144.774748

Cited by 12 publications

(3 citation statements)

References 9 publications

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“…Fig. 4 shows a schematic diagram of the inner lead formation, in which the forming height can be determined based on a trigonometric relation (5) where is the inner lead length, is the distance from the chip center to the device hole edge, and is the distance form the chip center to the outer bump edge. The extension lengths at the bump front and back edges are empirically set at 20 m as the dimensional buffers covering the chip rotation and tilt variations during the ILB.…”

Section: Geometrical Forming Designmentioning

confidence: 99%

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Recipe optimization and design software development of tape carrier package (TCP) inner lead bonding (ILB)

Yoon²,

Ahn³

et al. 2005

IEEE Trans. Electron. Packag. Manufact.

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This paper proposes an optimization methodology for quickly determining a bonding recipe for the inner lead bonding (ILB) of a tape carrier package (TCP). The recipe consists of the bonding force, stage temperature, bonding time, and geometrical forming. The bonding force derivation was based on the essential relationship between the bonding force and sinking value from the referred literature. The remaining three parameter equations were derived using empirical accumulation. The experimental data were collected by conducting eight TCP product trial runs to validate the methodology. In addition, the user-interface software was programmed to be user friendly. The development cycle time can be condensed from the average number of hours to less than one hour, revealing a time saving improvement during practical applications. Good yield rates were obtained as well.Index Terms-Bonding recipe, inner lead bonding (ILB), tape carrier package (TCP).

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Section: Geometrical Forming Designmentioning

confidence: 99%

“…The optimal bonding ranges for the tool temperature, bonding pressure, and bonding time were found by examining the pull test results. Oshige and Nakanishi [3] applied a simple two-dimensional (2-D) [5] adopted a 2-D contact model to analyze the size ratio effect between the pad thickness and lead height. Fig.…”

Section: Introductionmentioning

confidence: 99%

Recipe optimization and design software development of tape carrier package (TCP) inner lead bonding (ILB)

Yoon²,

Ahn³

et al. 2005

IEEE Trans. Electron. Packag. Manufact.

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“…Many numerical studies have been reported for gold ball bonding [21], wire bonding [22][23][24][25][26], bump bonding [18,27] and TAB [1,28] to quantitatively understand the plastic deformation of the wire (or bump and TAB leads), stress conditions during bonding, and interfacial intimate contact process between the wire and pad. The boundary conditions in numerical simulations have a large influence on the numerical results.…”

Section: Introductionmentioning

confidence: 99%

Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding

Takahashi

Fukuda

Yoneshima

et al. 2017

Journal of Electronic Packaging

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Low-temperature microjoining, such as wire (or ribbon) bonding, tape automated bonding (TAB), and flip chip bonding (FCB), is necessary for electronics packaging. Each type of microjoining takes on various aspects but has common bonding mechanisms regarding friction slip, plastic deformation, and friction heating. In the present paper, solid-state microjoining mechanisms in Au wire (ball) bonding, FCB, Al wire bonding (WB), and Al ribbon bonding are discussed to systematically understand the common bonding mechanisms. Ultrasonic vibration enhances friction slip and plastic deformation, making it possible to rapidly obtain dry interconnects. Metallic adhesion at the central area of the bonding interface is mainly produced by the friction slip. On the other hand, the folding of the lateral side surfaces of the Au bump, Au ball, and Al wire is very important for increasing the bonded area. The central and peripheral adhesions are achieved by a slip-and-fold mechanism. The solid-state microjoining mechanisms of WB and FCB are discussed based on experimental results.

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Microtechnology and MEMS

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Numerical analysis of fine lead bonding-effect of pad thickness on interfacial deformation

Cited by 12 publications

References 9 publications

Recipe optimization and design software development of tape carrier package (TCP) inner lead bonding (ILB)

Recipe optimization and design software development of tape carrier package (TCP) inner lead bonding (ILB)

Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding

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