2023
DOI: 10.1149/1945-7111/ace1ab
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Nucleation and Growth of Cu2O: Role of Potential, Electrolyte pH, and Substrate

Abstract: The nucleation and growth mechanism of functional oxides have a direct bearing on the structural and electronic properties of the deposit. We study the effect of electrolyte pH and deposition potential on the nucleation and growth of Cu2O on polycrystalline metal oxide (FTO) & metal (Au) substrates. Modelling of the recorded current-time transients indicates that both instantaneous and progressive nucleation occur with growth limited by diffusion or lattice incorporation of electro-active species or both. … Show more

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Cited by 3 publications
(4 citation statements)
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“…29,30 Previous studies have commonly utilized temperatures of 55 °C and 60 °C for Cu 2 O deposition. 17,[31][32][33] Considering this, we selected a deposition temperature of 55 °C for our study. 2b, indicate the formation of copper at longer deposition time (according to JCPDS Card No.…”
Section: Resultsmentioning
confidence: 99%
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“…29,30 Previous studies have commonly utilized temperatures of 55 °C and 60 °C for Cu 2 O deposition. 17,[31][32][33] Considering this, we selected a deposition temperature of 55 °C for our study. 2b, indicate the formation of copper at longer deposition time (according to JCPDS Card No.…”
Section: Resultsmentioning
confidence: 99%
“…Such behavior has been noted earlier by Hills et al and others and suggests that the system is undergoing an electrochemical nucleation process. 31,38,39 The important point to note is that the cathodic current in the voltammogram will saturate at a particular value, irrespective of whether it is under Cu 2+ diffusion control or kinetic control of the formation of Cu 2 O. Based on Fig.…”
Section: Resultsmentioning
confidence: 99%
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“…Cuprous oxide is one such TMO semiconductor, whose widespread adoption in applications such as solar photovoltaics, photoelectrochemical cells and so on has been limited by defects [13,[19][20][21][22][23][24][25][26][27][28][29][30][31][32]. Non-stoichiometry in cuprous oxide occurs due to the facile and irrepressible formation of two shallow acceptor defects, copper vacancies (V ′ Cu ) and copper split vacancies (V ′ Cu split) [33,34].…”
Section: Introductionmentioning
confidence: 99%