2005
DOI: 10.1016/j.jcrysgro.2005.07.016
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Nucleation and growth mode of the molecular beam epitaxy of GaN on 4H–SiC exploiting real time spectroscopic ellipsometry

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Cited by 13 publications
(4 citation statements)
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“…Furthermore, additional examples of SE real-time control of nucleation and heteroepitaxial growth of III-Nitrides (e.g., GaN, InN, etc.) by molecular beam epitaxy are provided by Losurdo et al ( 2005 ) and Cobet et al ( 2003 ), giving evidence of the versatility of real-time SE to monitor (detect) at the nanoscale, independent of the deposition methodology and material systems.…”
Section: Introductionmentioning
confidence: 99%
“…Furthermore, additional examples of SE real-time control of nucleation and heteroepitaxial growth of III-Nitrides (e.g., GaN, InN, etc.) by molecular beam epitaxy are provided by Losurdo et al ( 2005 ) and Cobet et al ( 2003 ), giving evidence of the versatility of real-time SE to monitor (detect) at the nanoscale, independent of the deposition methodology and material systems.…”
Section: Introductionmentioning
confidence: 99%
“…Growth is performed under various Ga/N flux ratios at growth temperatures in the range 710-780 . In-situ spectroscopic ellipsometry (SE) is a complementary and powerful method for monitoring the growth process, and characterizing film properties [5].In this paper, we report on an in-situ SE investigation of homoepitaxial GaN growth on GaN template substrates by PAMBE. We discuss SE investigations related to the growth and surface roughening, as well as Ga adsorption and desorption dynamics with various Ga/N ratio conditions.…”
mentioning
confidence: 99%
“…plasma assisted MBE on Si-face 6H-SiC substrates with a two-step process consisting of the deposition of a thin layer deposited at 350 °C, followed by its annealing and the subsequent deposition of the epitaxial layer. Substrates underwent a degreasing and wet chemical cleaning using the RCA procedure followed by in-situ cleaning using a Ga-flash off consisting of three cycles of 2 ML Ga deposited at 650 o C, followed by Ga desorption for 5 min at 825 o C [8]. After the cleaning, a sharp (1x3) RHEED pattern, indicative of a clean Si-face surface, was observed.…”
mentioning
confidence: 99%
“…power of 500 W and at a nitrogen flow rate of 0.95 sccm. These conditions yield a thin (1.2 ML) of nitrided layer [8]. A low-temperature InN nucleation layer approximately 50 nm thick was grown at 350 °C using an In flux of 2x10 -7 Torr.…”
mentioning
confidence: 99%