2015
DOI: 10.1016/j.solmat.2014.11.016
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Novel texturing process for diamond-wire-sawn single-crystalline silicon solar cell

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Cited by 63 publications
(27 citation statements)
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“…2 also shows that deeper saw marks have a larger micro-texture size than shallower ones. However, it is also clear that (very) shallow saw marks remain on the surfaces even after micro-texturing for both materials, mainly because of the two different etching speeds between the two kinds of saw marks 65 . The saw damage resulting from the DWS process is clearly not enough for a standard anisotropic acidic micro-texturing process to form an acceptable antireflection layer for PV.…”
Section: Methodsmentioning
confidence: 99%
“…2 also shows that deeper saw marks have a larger micro-texture size than shallower ones. However, it is also clear that (very) shallow saw marks remain on the surfaces even after micro-texturing for both materials, mainly because of the two different etching speeds between the two kinds of saw marks 65 . The saw damage resulting from the DWS process is clearly not enough for a standard anisotropic acidic micro-texturing process to form an acceptable antireflection layer for PV.…”
Section: Methodsmentioning
confidence: 99%
“…More exciting, the profile as well as the orientation of the micron pits is not very evident. Our previous work showed that easing off the saw marks could significantly benefit the cell performance [22]. The height and diameter of the nanostructure are in the range of 100-200 nm.…”
Section: Microstructure and Reflection Evolution Of Dws Mc-si Wafers mentioning
confidence: 99%
“…Therefore, DWS is expected to become a next-generation slicing technique for fabricating wafer-based Si solar cells. In fact, DWS sc-Si solar cells that are fabricated in production lines have shown comparable photovoltaic properties to MWSS ones [6].…”
Section: Introductionmentioning
confidence: 99%
“…To fabricate a pyramidal texture with good uniformity, many scholars have performed a lot of research on the texturing process. Chen et al used an alkali solution for polishing before texturing to obtain a relatively uniform distribution of a pyramidal texture on a surface, and the light absorption performance and minority carrier lifetime were significantly improved [12]. Wang et al used a mixture of TMAH and IPA to perform chemical texturing on a silicon wafer and obtained a small and uniform pyramidal texture on the surface, which greatly improved the PCE of the silicon cell [13].…”
Section: Introductionmentioning
confidence: 99%