Novel temperature dependent tensile test of freestanding copper thin film structures

Smolka, Martin; Detzel, Thomas; Robl, W.; Grießer, Thomas; Wimmer, Alexander; Dehm, Gerhard

doi:10.1063/1.4725529

Cited by 25 publications

(26 citation statements)

References 42 publications

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“…[9]. After electro-deposition, one set of samples was annealed at 673 K for 30 min to obtain a stable grain size of 2.7 ± 0.6 lm.…”

Section: Methodsmentioning

confidence: 99%

“…In these experiments the influence of temperature and stress cannot be separated. Consequently, experiments for static tensile [9][10][11] and cyclic tension-tension testing [12][13][14][15] of freestanding films have been developed. As in practical applications where cyclic loading with a negative stress ratio R = r min /r max frequently occurs, there is demand for micromechanical testing where tensile and compressive stresses alternate to identify the underlying deformation mechanism.…”

Section: Introductionmentioning

confidence: 99%

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Cyclic bending experiments on free-standing Cu micron lines observed by electron backscatter diffraction

et al. 2015

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“…[9]. After electro-deposition, one set of samples was annealed at 673 K for 30 min to obtain a stable grain size of 2.7 ± 0.6 lm.…”

Section: Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Cyclic bending experiments on free-standing Cu micron lines observed by electron backscatter diffraction

et al. 2015

Self Cite

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“…Several studies have been performed on the high-temperature behavior of films on substrates [2,[16][17][18][19], but studies on freestanding films have been limited to temperatures below 200ºC [20][21][22][23] due to difficulties associated with sample handling, oxidation, and temperature uniformity in the sample. The few studies performed at higher temperatures focused on films that were several microns thick [24][25][26]. Thus, the high-temperature behavior of freestanding metal thin films is still relatively unexplored.…”

Section: Introductionmentioning

confidence: 99%

“…The oxidation resistance makes gold an interesting material for studying the inherent mechanical behavior at elevated temperature without the added complication of a passivation layer. Gold films are also increasingly used in a broad range of devices and sensors [24][25][26].…”

Section: Introductionmentioning

confidence: 99%

High-temperature tensile behavior of freestanding Au thin films

Sim

Vlassak

2014

Scripta Materialia

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The mechanical behavior of freestanding thin sputter-deposited films of Au is studied at temperatures up to 340°C using tensile testing. Films tested at elevated temperatures exhibit a significant decrease in flow stress and stiffness. Furthermore the flow stress decreases with decreasing film thickness, contravening the usual notion that "smaller is stronger". This behavior is attributed mainly to diffusion-facilitated grain boundary sliding.Keywords: In situ tensile test, High-temperature deformation, Thin films, Grain boundary sliding, Creep IntroductionThe decreasing size of microelectronics devices has motivated a strong interest in the effects of length scales on the mechanical behavior of thin films of metal. As a result, metal thin films, which are key components in these devices, have been studied extensively. These investigations have demonstrated that the mechanical properties of thin films are generally very different from those of their bulk counterparts [1][2][3][4][5][6][7][8][9][10][11] and that they depend on whether the film is freestanding or supported by a substrate [12][13][14][15]. Understanding the mechanical behavior of metal thin films at elevated temperature is essential for the design of reliable devices, which often operate above room temperature. Several studies have been performed on the high-temperature behavior of films on substrates [2,[16][17][18][19], but studies on freestanding films have been limited to temperatures below 200ºC [20][21][22][23] due to difficulties associated with sample handling, oxidation, and temperature uniformity in the sample. The few studies performed at higher temperatures focused on films that were several microns thick [24][25][26]. Thus, the high-temperature behavior of freestanding metal thin films is still relatively unexplored. Recently, we developed a technique for the tensile testing of freestanding thin films in which samples were mounted on a micro-machined silicon frame with integrated heaters [27]. The samples were deformed in-situ inside a scanning electron microscope (SEM) by means of a custom-built test apparatus. Using this technique, the stress-strain curves of copper thin films were measured at temperatures up to 430°C. In this paper, the same technique is used to characterize the mechanical behavior of gold films as a function of temperature and strain rate. Gold was chosen as the material of interest due to its oxidation resistance and low electrical resistivity. The oxidation resistance makes gold an interesting material for studying the inherent mechanical behavior at elevated temperature without the added complication of a passivation

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“…Finally, concerning challenge (III), the range of dimensions require custom solutions for measuring the involved forces and deformations. High-resolution deformation measurements are feasible through in-situ microscopy, which also greatly enhances micromechanical analyses [47][48][49].…”

Section: Introductionmentioning

confidence: 99%

On-wafer time-dependent high reproducibility nano-force tensile testing

Bergers¹,

Hoefnagels²,

Geers³

2014

J. Phys. D: Appl. Phys.

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Time-dependent mechanical investigations of on-wafer specimens are of interest for improving the reliability of thin metal film microdevices. This paper presents a novel methodology, addressing key challenges in creep and anelasticity investigations through on-wafer tensile tests, achieving highly reproducible force and specimen deformation measurements and loading states. The methodology consists of a novel approach for precise loading using a pinin-hole gripper and a high-precision specimen alignment system based on three-dimensional image tracking and optical profilometry resulting in angular alignment of <0.1 mrad and near-perfect co-linearity. A compact test system enables in situ tensile tests of on-wafer specimens under light and electron microscopy. Precision force measurement over a range of 0.07 µN to 250 mN is realized based on a simple drift-compensated elastically-hinged load cell with high-precision deflection measurement. The specimen deformation measurement, compensated for drift through image tracking, yields displacement reproducibility of <6 nm. Proof of principle tensile experiments are performed on 5 µm-thick aluminum-alloy thin film specimens, demonstrating reproducible Young's modulus measurement of 72.6 ± 3.7 GPa. Room temperature creep experiments show excellent stability of the force measurement and underline the methodology's high reproducibility and suitability for time-dependent nanoforce tensile testing of on-wafer specimens.

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Novel temperature dependent tensile test of freestanding copper thin film structures

Cited by 25 publications

References 42 publications

Cyclic bending experiments on free-standing Cu micron lines observed by electron backscatter diffraction

Cyclic bending experiments on free-standing Cu micron lines observed by electron backscatter diffraction

High-temperature tensile behavior of freestanding Au thin films

On-wafer time-dependent high reproducibility nano-force tensile testing

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