Novel Structure and Fabrication Process for Integrated RF Microelectromechanical-System Technology

Kuwabara, Kei; Urano, Masami; Kodate, Junichi; Satô, Norio; Morimura, Hiroki; Sakata, Tomomi; Ishii, H.; Kamei, Takayuki; Kudou, Kazuhisa; Yano, Masaki; Machida, Katsuyuki

doi:10.1143/jjap.45.6849

Cited by 19 publications

(12 citation statements)

References 17 publications

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“…Micro-electro-mechanical system (MEMS) devices have been significantly improved for the last few decades, and many types of MEMS devices, for example, microsensors, 1,2) mechatronics, 3) optical MEMS, 4,5) RF MEMS, 6) and bio-MEMS, 7) have been developed. Microelements of MEMS are dominantly made of silicon, metal oxides, and metals; in contrast, polymer materials have been mainly used as temporary materials for manufacturing devices, for example, masks for etching, molds for sputtering, and sacrificing layers for three-dimensional microfabrication.…”

Section: Introductionmentioning

confidence: 99%

Effects of Aspect Ratio of Photoresist Patterns on Adhesive Strength between Microsized SU-8 Columns and Silicon Substrate under Bend Loading Condition

Ishiyama

Shibata

Sone

et al. 2010

Jpn. J. Appl. Phys.

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The adhesive strength between microsized SU-8 columns and a silicon substrate under the bend loading condition has been studied to clarify effects of the columnar aspect ratio. The maximum tensile stresses at the root are almost the same within the range of high aspect ratios (1.4–2.1) of the SU-8 columns, in which delamination cracks are opened by bend loading (mode I). This result shows that the delamination is induced by the maximum tensile stress at the root. On the other hand, the maximum tensile stress irregularly changes within the range of low aspect ratios (0.8–1.1) of the specimens and features of the delamination surfaces differ from those within the range of high aspect ratios. This result suggests that the delamination mode must change from mode I to mode II or the complex mode. All the results show that the adhesive strength of a SU-8 column with the range of high aspect ratios of 1.4 and more obtained from the adhesive bend test can be analyzed as the maximum tensile stress at the root (the adhesive bend strength) in this study.

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Section: Introductionmentioning

confidence: 99%

Effects of Aspect Ratio of Photoresist Patterns on Adhesive Strength between Microsized SU-8 Columns and Silicon Substrate under Bend Loading Condition

Ishiyama

Shibata

Sone

et al. 2010

Jpn. J. Appl. Phys.

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“…Thus, gold could be a candidate material for small proof mass size. In addition, gold material should also be suitable for the fabrication process of the CMOS-MEMS accelerometer that gold electroplating has successfully stacked MEMS on an LSI circuit [26,35,36]. Figure 8 shows the fabrication process flow for the designed MEMS accelerometer.…”

Section: Proof Mass Materialsmentioning

confidence: 99%

Multi-Physics Simulation Platform and Multi-Layer Metal Technology for CMOS-MEMS Accelerometer with Gold Proof Mass

Machida¹,

Konishi²,

Yamane³

et al. 2019

Novel Metal Electrodeposition and the Recent Application

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This chapter describes technical features and solutions to realize a highly sensitive CMOS-MEMS accelerometer with gold proof mass. The multi-physics simulation platform for designing the CMOS-MEMS device has been developed to understand simultaneously both mechanical and electrical behaviors of MEMS stacked on LSI. MEMS accelerometer fabrication process is established by the multilayer metal technology, which consists of the gold electroplating and the photosensitive polyimide film. The proposed MEMS accelerometers are fabricated and evaluated to verify the effectiveness of the proposed techniques regarding sub-1G MEMS and arrayed MEMS devices. The experimental results show that the Brownian noise of the sub-1G MEMS accelerometer can achieve 780 nG/(Hz) 1/2 and the arrayed MEMS accelerometer has a wide detection, ranging from 1.0 to 20 G. Moreover, using the developed simulation platform, we demonstrate the proposed capacitive CMOS-MEMS accelerometer implemented by the multi-layer metal technology. In conclusion, it is confirmed that the multi-physics simulation platform and the multi-layer metal technology for the CMOS-MEMS device have a potential to realize a nano-gravity sensing technology.

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“…Accordingly, gold could be a leading candidate material for a small proof mass with a low noise floor. In addition, gold should also be a suitable material for the fabrication process of the proposed CMOS MEMS accelerometer, as we have previously reported [30][31][32] that gold electroplating has successfully enabled us to integrate MEMS structures on an LSI chip in a post-CMOS process. Table I.…”

Section: Materials Of Proof Massmentioning

confidence: 99%

Novel Sensor Structure and Its Evaluation for Integrated Complementary Metal Oxide Semiconductor Microelectromechanical Systems Accelerometer

Konishi

Yamane

Matsushima

et al. 2013

Jpn. J. Appl. Phys.

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This paper reports a novel sensor structure and its evaluation results for an integrated complementary metal oxide semiconductor (CMOS) microelectromechanical systems (MEMS) accelerometer with a wide detection range on a chip. The proposed sensor structure has the following features: i) a layer separation technique between the proof mass and the mechanical suspensions, ii) mechanical stoppers for the proof mass to avoid destruction, and iii) a SiO 2 film underneath the proof mass to prevent stiction and electrical short. Gold was used as the MEMS structure material to reduce the proof mass size and to lower the Brownian noise to below 100 g/ ffiffiffiffiffiffi Hz p . Furthermore, the micro fabrication was carried out below 310 C for the CMOS devices to remain intact. The evaluation results indicate that the Brownian noise was 90.6 g/ ffiffiffiffiffiffi Hz p. Thus, we have confirmed that the proposed MEMS structure has the potential for use in future integrated CMOS-MEMS accelerometers.

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Novel Structure and Fabrication Process for Integrated RF Microelectromechanical-System Technology

Cited by 19 publications

References 17 publications

Effects of Aspect Ratio of Photoresist Patterns on Adhesive Strength between Microsized SU-8 Columns and Silicon Substrate under Bend Loading Condition

Effects of Aspect Ratio of Photoresist Patterns on Adhesive Strength between Microsized SU-8 Columns and Silicon Substrate under Bend Loading Condition

Multi-Physics Simulation Platform and Multi-Layer Metal Technology for CMOS-MEMS Accelerometer with Gold Proof Mass

Novel Sensor Structure and Its Evaluation for Integrated Complementary Metal Oxide Semiconductor Microelectromechanical Systems Accelerometer

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