Novel Slow-wave Structure using Bond-Wire for Miniaturizing Microwave Devices

Lim, Young-Kwang; Lee, Hai‐Young

doi:10.1109/apmc.2007.4554758

Cited by 6 publications

(9 citation statements)

References 9 publications

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“…Adopting much longer crossing bond wires, a slow-wave factor (SWF) of 7.3 is achieved, which is 82% size reduction compared with the couplers proposed in [12,13].…”

Section: Introductionmentioning

confidence: 86%

“…Accordingly, many methods using lumped elements [1][2][3], meander lines [4], coupled lines [5], open stubs [6], right/left handed transmission lines [7,8] and periodic slow-wave loading [9][10][11] have been proposed for size reduction. Lim and Lee proposed a slow-wave transmission line with a SWF of 4.5 using bond wires [12] and used it to design a compact branch-line coupler with a size reduction of 69% [13] compared with a convention microstrip one. Zhou et al proposed a miniaturized power divider using crossed bond wires, which achieved 80% size reduction compared to a conventional Wilkinson power divider [14].…”

Section: Introductionmentioning

confidence: 99%

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Compact Slow-Wave Branch-Line Coupler Using Crossing Bond Wires

Zhou¹,

Ma²,

Yan³

et al. 2017

PIER Letters

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Abstract-This paper proposes a compact and miniaturized branch-line coupler using a crossing bond wire structured slow-wave branch line (CBWSWB). The proposed coupler achieves a size reduction of 82% compared with a conventional implementation. Measured S 11 , S 21 , S 31 and S 41 of the proposed coupler are better than −24, −3.7, −3.7 and −28 dB at 3 GHz, respectively. Furthermore, the phase difference between through and coupling ports of the coupler is within 1 • .

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“…Adopting much longer crossing bond wires, a slow-wave factor (SWF) of 7.3 is achieved, which is 82% size reduction compared with the couplers proposed in [12,13].…”

Section: Introductionmentioning

confidence: 86%

Section: Introductionmentioning

confidence: 99%

Compact Slow-Wave Branch-Line Coupler Using Crossing Bond Wires

Zhou¹,

Ma²,

Yan³

et al. 2017

PIER Letters

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show abstract

“…Many compact structures, such as the electromagnetic bandgap (EBG) [1], the defected ground structure (DGS) [2] and the periodic photonic bandgap (PBG) [3] have been proposed to suppress high-order harmonics due to their slow-wave and bandstop characteristics. Kim et al proposed a slow-wave structure using bond wires, which achieved a slowwave factor of 4.5 [4].In this Letter, a slow-wave effect enhanced branch line power divider is proposed. Adopting much longer crossing bond wires, the slow-wave factor is improved greatly to 8.2 without increasing circuit size compared to the one proposed in [4].…”

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confidence: 93%

Slow-wave effect enhanced branch line power divider using crossing bond wires

2011

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A novel slow-wave effect enhanced branch line power divider with harmonics suppression and size reduction characteristics using crossing bond wires is proposed. The proposed slow-wave structure effectively shortens branch line length by 50% compared to the branch line of the conventional Wilkinson power divider. 40 dB suppression for the third harmonic and 50 dB suppression for the fifth harmonic are obtained.Introduction: Minimising harmonic distortion from nonlinear active components is a great challenge in microwave circuit design. Many compact structures, such as the electromagnetic bandgap (EBG) [1], the defected ground structure (DGS) [2] and the periodic photonic bandgap (PBG) [3] have been proposed to suppress high-order harmonics due to their slow-wave and bandstop characteristics. Kim et al. proposed a slow-wave structure using bond wires, which achieved a slowwave factor of 4.5 [4].In this Letter, a slow-wave effect enhanced branch line power divider is proposed. Adopting much longer crossing bond wires, the slow-wave factor is improved greatly to 8.2 without increasing circuit size compared to the one proposed in [4]. The proposed slow-wave enhanced structure effectively shortens the branch line length by 50% compared to the branch line of the conventional Wilkinson power divider. Also, 39 dB suppression for the third harmonic and 52 dB suppression for the fifth harmonic are obtained.

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“…In order to overcome the space limitations of on-chip waveguides, Lim et al [107] have created slow wave structures for the lower GHz frequency range from co-planar on-chip capacitor plates connected via wire bonds to form a classical lumped LC transmission line structure. The authors claim to be a factor 1.6 better than comparable completely on-chip structures, and can achieve the required large inductance and capacitance at low footprint and low mask expense.…”

Section: A) B)mentioning

confidence: 99%

Unconventional applications of wire bonding create opportunities for microsystem integration

Fischer

Korvink

Roxhed

et al. 2013

J. Micromech. Microeng.

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, G. et al. (2013) "Unconventional applications of wire bonding create opportunities for microsystem integration" Journal of Micromechanics and Microengineering, 23(8) Abstract. Automatic wire bonding is a highly mature, cost-efficient and broadly available back-end process, intended to create electrical interconnections in semiconductor chip packaging. Modern production wire bonding tools can bond wires with speeds of up to 30 bonds per second with placement accuracies of better than 2 µm, and the ability to form each wire individually into a desired shape. These features render wire bonding a versatile tool also for integrating wires in applications other than electrical interconnections. Wire bonding has been adapted and used to implement a variety of innovative microstructures. This paper reviews unconventional uses and applications of wire bonding that have been reported in the literature. The used wire bonding techniques and materials are discussed, and the implemented applications are presented. They include the realization and integration of coils, transformers, inductors, antennas, electrodes, through silicon vias (TSVs), plugs, liquid and vacuum seals, plastic fibers, shape memory alloy (SMA) actuators, energy harvesters, and sensors.

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Novel Slow-wave Structure using Bond-Wire for Miniaturizing Microwave Devices

Cited by 6 publications

References 9 publications

Compact Slow-Wave Branch-Line Coupler Using Crossing Bond Wires

Compact Slow-Wave Branch-Line Coupler Using Crossing Bond Wires

Slow-wave effect enhanced branch line power divider using crossing bond wires

Unconventional applications of wire bonding create opportunities for microsystem integration

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