2008
DOI: 10.1016/j.microrel.2008.07.041
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Novel simulation approach for transient analysis and reliable thermal management of power devices

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Cited by 2 publications
(1 citation statement)
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“…This connection ensures three functions (Micol et al 2009;Darveaux & Banerji 1992;Wangetal.2001).The first ismechanical because the integrity of the structure is obtained by these connections, both substratesbeingmaintainedbythe"bumps".Thesecondisthermal, with better dissipation of heat, which can occur through both sides of the substrate. The third is electrical, as the power is brought to the component through these connections (Lhommeau et al 2007;Nelhiebel et al 2013;Castellazzi and Ciappa 2008;Van der Broeck et al 2015;Deshpande & Subbarayan 2000;Feller et al 2008).…”
Section: Contextmentioning
confidence: 99%
“…This connection ensures three functions (Micol et al 2009;Darveaux & Banerji 1992;Wangetal.2001).The first ismechanical because the integrity of the structure is obtained by these connections, both substratesbeingmaintainedbythe"bumps".Thesecondisthermal, with better dissipation of heat, which can occur through both sides of the substrate. The third is electrical, as the power is brought to the component through these connections (Lhommeau et al 2007;Nelhiebel et al 2013;Castellazzi and Ciappa 2008;Van der Broeck et al 2015;Deshpande & Subbarayan 2000;Feller et al 2008).…”
Section: Contextmentioning
confidence: 99%