Novel Process For A Monolithic Integrated Accelerometer

Stability of a micromechanical pull-voltage reference

“…A modification on surface micromachining, a so-called epi-poly process [8], [9], was used for the fabrication of 11-m-thick single-sided clamped 100-m-long free-standing test structures with electrodes (Fig. 2).…”

Micromechanical voltage reference using the pull-in of a beam

“…Second, the 5-10 nm/min deposition rate of the conventional low-pressure chemical vapor deposition (LPCVD) limits the practical layer thickness to about 2 m. Epitaxial growth at about 700 nm/min can be used to yield polysilicon layers on top of a dielectric layer with a thickness in excess of 10 m, thus solving the second problem. Such a process is generally referred to as an epi-poly process [13], [14]. After deposition the thick polysilicon layer can be patterned using deep reactive ion etching (DRIE).…”

Measuring and interpreting the mechanical–thermal noise spectrum in a MEMS

“…The microstructure shown in figure 4, fabricated in the Bosch epi-poly process [17,18], was used for the experimental measurements of the dynamic pull-in transition. The device has four folded beams, 340 µm long and 2.5 µm wide, connected to two rigid central bars of about 1 mm length.…”